Rev: 2021 Aug.
Middle Tg / Low Dk / Halogen Free
EM-355(D) / EM-355B(D)
Low Dk for impedance control
Superior thermal resistance for lead-free process
Low moisture absorption
Similar to FR-4 PCB processing
Applicable IPC Slash Sheets: IPC-4101/127,/128
Basic Laminate Property
Property
Item
IPC-TM-650
Test Condition
Unit
Typical Value
Thermal
Tg
2.4.25
DSC
℃
155
2.4.24
TMA
��
150
2.4.24.4
DMA
℃
175
CTE, X/Y-axis
2.4.24.5
< Tg, TMA
ppm/℃
12/15
CTE, Z-axis
2.4.24
< Tg, TMA
ppm/℃
35~40
> Tg, TMA
ppm/℃
200~220
Z-axis Expansion
2.4.24
50~260℃
%
2.8
Td
2.4.24.6
TGA (5% W.L)
℃
385
T288
2.4.24.1
Clad
Min
>60
Etched
Min
>60
Electrical
Dk
(R/C: 70%)
2GHz
Cavity
Resonator
C-24/23/50
-
3.4
Df
(R/C: 70%)
2 GHz
C-24/23/50
-
0.013
Volume Resistivity
2.5.17.1
C-96/35/90
MΩ-cm
>10
10
Surface Resistivity
2.5.17.1
C-96/35/90
MΩ
>10
9
Physical
Water Absorption
2.6.2.1
E-1/105+D-24/23
%
0.10
Peel
Strength
(HTE)
0.5 oz
2.4.8
As Received
lb/in
6.5
After Thermal
Stress
lb/in
6.5
Flexural
Strength
Warp
2.4.4
As Received
MPa
510~570
Fill
As Received
MPa
450~500
Flame Resistance
UL-94
A & E-24/125
-
V-0
Above typical values are tested under specified constructions and not intended for specification.