No. Part Name
Mat
erial
Name
Component
wt (mg)
Material Content
(Element)
CAS Number
Element wt
(%)
Element wt
(mg)
wt % of Total
unit wt
PPM
Thermosetting resin (including filler) Trade Secret 27.20%
9.750 5.87% 272000
Glass cloth
65997-17-3 27.20%
9.750 5.87% 272000
Talc containing no asbestiform fibers 14807-96-6 0.38%
0.137 0.08% 3824
Morpholine derivative Trade secret 0.38%
0.137 0.08% 3824
Barium sulfate 7727-43-7 4.21%
1.508 0.91% 42064
Silica, amorphous 7631-86-9 0.10%
0.034 0.02% 956
Dipropylene glycol monomethyl ether 34590-94-8 2.29%
0.822 0.50% 22944
Naphthalene 91-20-3 0.10%
0.034 0.02% 956
Epoxy resin A Trade secret 1.24%
0.445 0.27% 12428
Epoxy resin B 85954-11-6 0.86%
0.308 0.19% 8604
Copper 7440-50-8 9.54%
3.420 2.06% 95400
Copper 7440-50-8 22.26%
7.979 4.81% 222600
Nickel 7440-02-0 3.72%
1.333 0.80% 37200
Gold 7440-57-5 0.52%
0.186 0.11% 5200
Epoxy resin
Trade Secret
5.00%
4.384 2.64% 50000
2,2'-((2,2',5,5'-tetramethy-(1,1'-biphenyl)-
4,4'-diyl)-bis(oxymethylene))-bis-oxirane
Trade Secret
5.00%
4.384 2.64% 50000
Hardener
Trade Secret
5.00%
4.384 2.64% 50000
Carbon Black
1333-86-4
0.20%
0.175 0.11% 2000
Amorphous Silica 1
60676-86-0
80.80%
70.853 42.69% 808000
Amorphous Silica 2
7631-86-9
4.00%
3.508 2.11% 40000
2-(2-Ethoxyethoxy)ethyl acetate
112-15
-2
36.50%
0.268 0.16% 365000
Butadiene, acrylonitrile polymer, carboxy-
ter
minated, polymer with bisphenol A and
epichlorohydrin
68610-41
-3
28.00%
0.205 0.12% 280000
I
sodecyl alcohol, ethoxylated
61827-42-7
10.00%
0.073 0.04% 100000
Silica Filler
112926-00-8
25.00%
0.183 0.11% 250000
T
ert-butyl peroxyneodecanoate
26748-41
-4
0.50%
0.004 0.00% 5000
Tin 7440-31-5 96.50%
32.692 19.70% 965000
Silver 7440-22-4 3.00%
1.016 0.61% 30000
Copper 7440-50-8 0.50%
0.169 0.10% 5000
Gold 7440-57-5 99.99%
0.202 0.12% 999900
Others Trade Secret 0.01%
0.000 0.00% 100
6 Die Chip 7.622
Silicon 7440-21-3 100.00%
7.622 4.59% 1000000
165.97 600.00% 165.970 100.00% 6000000
1
2
3
4
Epoxy
Solder ball
AS4C64M16D3LC-12BCN / AS4C64M16D3LC-12BIN
165.97mg
5
Part Number:
Part Weight:
Gold wire
Substrate
Mold
compound
0.733
33.878
0.202Au
35.66
87.875
6202C
SnAgCu
HL-832NX-A /
AUS 308
CEL-9120HF
Alliance Memory Inc. 12815 NE 124th Street Suite D Kirkland, WA 98034 Tel: 425-898-4456
Fax: 425-896-8628 Alliance Memory Inc. reserves the right to change products or specification without notice
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