No. Part Name Mate

rial Name

Component wt

(mg)

Material Content

(Element)

CAS Number

Element wt

(%)

Element wt

(mg)

wt % of Total unit

wt

PPM

Cured epoxy resin Trade secret

7.36% 0.028 0.02% 73642.5

Inorganic filler

60676-86-0

21645-51-2

7.91% 0.030 0.02% 79097.5

Woven glass cloth 65997-17-3

13.64% 0.053 0.04% 136375

Chromium 7440-47-3

0.27% 0.001 0.00% 2727.5

Copper foil

7440-50-8

25.37% 0.098 0.07% 253657.5

Acrylic Resin Trade secret

7.11% 0.027 0.02% 71064

Organic pigments Trade secret

0.10% 0.000 0.00% 987

Phthalocyanine Blue Trade secret

0.10% 0.000 0.00% 987

Talc 14807-96-6

0.49% 0.002 0.00% 4935

Barium Sulfate 7727-43-7

5.72% 0.022 0.02% 57246

Silica Trade secret

0.10% 0.000 0.00% 987

2-Benzyl-2-dimethylamino-1-(4-

morpholino-phenyl)-

1-butanone

119313-12-1

0.49% 0.002 0.00% 4935

Defoamers/leveling agent etc. Trade secret

0.39% 0.002 0.00% 3948

Dipropyleneglycolmonomethylether

*)1-(2-methoxy-2-methylethoxy)-2-

propanol

34590-94-8

1.48% 0.006 0.00% 14805

3-methoxy-3-methylbutylacetate 103429-90-9

3.36% 0.013 0.01% 33558

Heavy Aromatic Solvent naphtha 64742-94-5

0.30% 0.001 0.00% 2961

Naphthalene 91-20-3

0.10% 0.000 0.00% 987

Copper Sulfate 7758-98-7

2.76% 0.011 0.01% 27600

Sulfuric acid 7664-93-9

0.33% 0.001 0.00% 3312

Nikel Sulfate 7786-81-4

0.11% 0.000 0.00% 1104

Confidential components Not Assigned

18.88% 0.073 0.05% 188784

Sulfur 7704-34-9

0.00% 0.000 0.00% 12.48

Nikel 7440-02-0

3.12% 0.012 0.01% 31187.52

Gold 7440-57-5

0.51% 0.002 0.00% 5100

Epoxy resin Trade secret

6.50% 5.357 3.93% 65000

hardener

Trade secret

5.00% 4.120 3.02% 50000

catalyst Trade secret

0.50% 0.412 0.30% 5000

Metal hydroxide Trade secret

9.50% 7.829 5.74% 95000

Carbon Black 1333-86-4

0.50% 0.412 0.30% 5000

Silicon dioxide 60676-86-0

70.00% 57.686 42.32% 700000

Silicon dioxide 7631-86-9

8.00% 6.593 4.84% 80000

2-(2-Etnoxyethoxy)ethyl acetate 112-15-2

25.00% 0.350 0.26% 250000

2-Propenenitrile, polymer with 1,3-

butadiene,

carboxy-terminated, polymers with

bisphenol A and

epic

68610-41-3

22.50% 0.315 0.23% 225000

Isodecyl alcohol,ethoxylated 61827-42-7

2.00% 0.028 0.02% 20000

ter-butyl peroxyneodecanoate 26748-41-4

0.20% 0.003 0.00% 2000

Others -

50.30% 0.703 0.52% 503000

Tin 7440-31-5

96.50% 32.162 23.60% 965000

Silver 7440-22-4

3.00% 1.000 0.73% 30000

Copper 7440-50-8

0.50% 0.167 0.12% 5000

Au 7440-57-5

99.99% 0.220 0.16% 999900

Others -

0.01% 0.000 0.00% 100

6 Die Chip 18.565

Silicon 7440-21-3

100.00% 18.565 13.62% 1000000

136.304 600.00% 136.304 100.00% 6000000

0.22

1

2

3

4

5

Substrate

Solder ball

CEL-9120HF

6202C

SnAgCu

82.408

1.398

33.328

0.385

AS4C256M16D4A-xxBCN / BIN

136.

304mg

Part Number:

Part Weight:

Gold wire Au

Mold compound

Epoxy

HL-932NX-A /

AUS 308

Alliance Memory Inc. 12815 NE 124th Street Suite D Kirkland, WA 98034 Tel: 425-898-4456

Fax: 425-896-8628 Alliance Memory Inc. reserves the right to change products or specification without notice

ALLIANCE MEMORY MDS REPORT