No. Part Name Material Name

Component

wt (mg)

Material Content

(Element)

CAS Number

Element wt

(%)

Element wt

(mg)

wt % of Total

unit wt

PPM

Talc containing no asbestiform fibers

14807-96-6 27.26%

0.110 0.08% 272600

Morpholine derivative

Trade secret 27.26%

0.110 0.08% 272600

Barium sulfate

7727-43-7 0.38%

1.213 0.88% 3816

Silica, amorphous

7631-86-9 0.38%

0.028 0.02% 3816

Dipropylene glycol monomethyl ether

34590-94-8 4.20%

0.661 0.48% 41976

Naphthalene

91-20-3 0.10%

0.028 0.02% 954

Epoxy resin A

Trade secret 2.29%

0.358 0.26% 22896

Epoxy resin B

85954-11-6 0.10%

0.248 0.18% 954

Thermosetting resin (including filler) Trade Secret 1.24%

7.874 5.75% 12402

Glass cloth

65997-17-3 0.86%

7.874 5.75% 8586

Copper

7440-50-8 9.48%

2.738 2.00% 94800

Copper

7440-50-8 22.14%

6.395 4.67% 221400

Nickel

7440-02-0 3.79%

1.095 0.80% 37900

Gold

7440-57-5 0.53%

0.153 0.11% 5300

Epoxy resin 1

Trade Secret

4.00%

2.885 2.11% 40000

Epoxy resin 2

Trade Secret

4.00%

2.885 2.11% 40000

Hardener

Trade Secret

5.00%

3.607 2.63% 50000

Metal hydroxide

Trade Secret

15.00%

10.820 7.89% 150000

Carbon black

1333-86-4

0.50%

0.361 0.26% 5000

Amorphous silica 1

60676-86-0

60.00%

43.279 31.58% 600000

Amorphous silica 2

7631-86-9

11.50%

8.295 6.05% 115000

2-(2-Ethoxyethoxy)ethyl acetate

112-15-2

36.50%

0.268 0.20% 365000

Butadiene, acrylonitrile polymer,

carboxy-terminated, polymer with

bisphenol A and epichlorohydrin

68610-41-3

28.00%

0.205 0.15% 280000

Isodecyl alcohol, ethoxylated

61827-42-7

10.00%

0.073 0.05% 100000

Silica Filler

112926-00-8

25.00%

0.183 0.13% 250000

Tert-butyl peroxyneodecanoate

26748-41-4

0.50%

0.004 0.00% 5000

Tin

7440-31-5 96.50%

26.563 19.38% 965000

Silver

7440-22-4 3.00%

0.826 0.60% 30000

Copper

7440-50-8 0.50%

0.138 0.10% 5000

Gold

7440-57-5 99.99%

0.161 0.12% 999900

Others

Trade Secret 0.01%

0.000 0.00% 100

6 Die Chip 7.622

Silicon

7440-21-3 100.00%

7.622 5.56% 1000000

137.06 600.00% 137.060 100.00% 6000000

0.161Au

28.886

72.132

6202C

SnAgCu

AS4C128M8D3LC-12BCN / AS4C128M8D3LC-12BIN

137.06mg

5

Part Number:

Part Weight:

Gold wire

Substrate

Mold

compound

0.733

27.526

1

2

3

4

Epoxy

Solder ball

HL-832NX-A /

AUS 308

CEL-9120HF

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D Kirkland, WA 98034

Tel: 425-898-4456

Fax: 425-896-8628

Alliance Memory Inc. reserves the right to change

products or specification without notice

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