2D4
www.connect.co.jp
www.jccherry.com
Heat Dissipation Substrate
･Light weight,high efficiency in heat exhaustion
･Applicable to a variety of purposes including Power Supply
･Board,In-vehicle equipments,and so on.
High performance heat dissipation
Plain side
Heat is dissipated on the plain side
and through Via hole.
Conventional Substrate
Performance
Temperature Cycle
：-65±3℃ 30min
125±3℃ 30min after 500 cycle
Pin Flatness
：Components side +0.03～0.05mm within
Soldering side +0.1 ～0.05mm within
Pin Retention Force
：No falling out
Pre Processing
：Temperature 40℃ Humidity 90％ Course 96Hr
※Reflow two times
Reflow Resistance
：Conductor float、Delamination、No Blister
Heat Dissipation Substrate
Efficiency in heat dissipation with small footprint
electrical current can be applied.
Combining with a heat sink,
more heat dissipation can
be expected.
Components mounting side
Soldering side
IC Power IC
Cross
section
of
Substrate
Image View(Heat dissipation VIA
Substrate is dissipating the heat)
Heat source
Heat dispersed throughout
Heat diffusion sheet and copper are laminated.
Thermal Conductivity 1700w/ｍ･k
Proportion 2.1g/cm
³
(8 times higher than aluminum,4 times higher
than copper in thermal conductivity)
Copper pin
Plain side
The above picture shows a Cu inlay φ2.0 ~ φ6.0 (Cu
pin embedded) substrate.It can be used for 1mm and
1.6mm thick substrates.
02040
10
20
30
40
T-Rise（℃）
Current(Amps)
T-Rise Current Chart(Reference)
Substrate thickness t=1.0
60
φ2 φ3
φ4
φ5
80
φ6
100
Copper pin dia.
Component
mounting
Measures aimed at heat dissipation
Measures aimed at heat dissipation
Component
mounting