P2 CAP HEAD
SPECIALTY MATERIALS
Overview
Entegris uses its innovative, low-temperature
Plasma Enhanced Chemical Vapor Deposition
(PECVD) process to deposit silicon oxide coatings
for various industrial applications, including semi-
conductor equipment chamber components. The
AR properties of the coating make it suitable for
coating IR optics. The OxiMax
™
coating has low
internal stress and is highly adherent and micro-
conformal to the substrate surface. This coating
is amorphous, highly dense and can be deposited
on a wide variety of substrate materials.
Applications
• Particle reduction during semiconductor
wafer processing
• Oxidation /corrosion resistant
• AR properties make it suitable for coating
IR optics
Features
• Optically transparent
• Excellent breakdown voltage
Ultrapure, transparent silicon oxide coating
OxiMax
™
COATING
Specifications
Substrate: Compatibility Most metals and ceramics
Size Up to 91 cm (36”)
Geometry Any shape, including complex geometries
Structure: Amorphous
Temperature: Deposition Max 150°C (302°F)
Use 1000°C (1832°F)
Coating thickness: A few nm to over 100 µm
Electrical resistivity:
~10
13
Ω-cm
Hardness: 800 HV
Dielectric strength: 80 V/micron
Purity: 99.9995%
Wear resistance: Very good
Corrosion resistance: Excellent aqueous corrosion resistance
Resistant to acids and alkalis