SPECIALTY GASES AND ENGINEERED MATERIALS
BENEFITS
—
• Fluorine and chlorine etch
resistance
• Oxidation resistance
• Low particle generation
• Dense and transparent
APPLICATIONS
—
• Semiconductor chamber
components
• Optical components
Pegasus
™
500
Series Coatings
Highly fluorine etch-resistant and
transparent coatings
Entegris’ Pegasus
™
500 series coatings are a family of precision-
engineered PVD coatings tailored for fluorine and chlorine
plasma etch applications. They are aluminum-based oxynitride
coatings deposited at low temperatures.
Pegasus 500 series coatings can be deposited on aluminum, alumina,
stainless steel and other commonly used substrate materials, with
superior adhesion. These coatings are highly transparent in the
visible and IR range. They are of high purity, exhibit homogeneous
microstructure and are conformal to the substrate surface.
Entegris’ Pegasus 500 series coatings are dense and excellent
barriers to corrosive chemistries in a semiconductor etch environ-
ment, protecting surfaces from erosion and minimizing particle
generation. The coatings are superior in etch resistance performance
compared to plasma sprayed coatings since they are dense, have
good cohesive strength and are not prone to particulation. This
improves device yield and improves productivity of semiconductor
etch tools in a manufacturing environment.
SPECIFICATIONS
—
Substrate
Compatibility Metals, Ceramics (e.g., Alumina, AlN) and Semiconductors
Size Up to 1016 mm D × 508 mm H (40” D × 20” H)
Structure
Microcrystalline
Temperature
Deposition <200°C (392°F)
Use 1000°C (1832°F)
Coating thickness
Up to 10 µm
Electrical resistivity
>10
12
Ω-cm
Purity
>99%
Hardness
1100 HV
Elastic modulus
190 GPa
Roughness
Conformal — substrate dependent
Wear resistance
Very good
Corrosion resistance
Excellent etch resistance in fluorine and chlorine environments
Oxidation-resistant up to 1000°C (1832°F) in air
Resistant to most acids and alkalis