Material Content Data Sheet

Sales Product Name ESD5V3U2U-03F H6327 Issued 29. August 2013

MA# MA000895446

Package PG-TSFP-3-1 Weight* 1.44 mg

Construction Element Material Group Substances

CAS#

if applicable

Weight

[mg]

Average

Mass

[%]

Sum

[%]

Average

Mass

[ppm]

Sum

[ppm]

chip non noble metal tin 7440-31-5 0.001 0.05 485

noble metal gold 7440-57-5 0.003 0.19 1883

inorganic material silicon 7440-21-3 0.020 1.40 1.64 13950 16318

leadframe inorganic material silicon 7440-21-3 0.000 0.01 80

non noble metal titanium 7440-32-6 0.001 0.04 399

non noble metal chromium 7440-47-3 0.002 0.12 1196

non noble metal copper 7440-50-8 0.570 39.70 39.87 397037 398712

wire noble metal gold 7440-57-5 0.005 0.36 0.36 3574 3574

encapsulation organic material carbon black 1333-86-4 0.008 0.54 5408

plastics epoxy resin - 0.167 11.63 116262

inorganic material silicondioxide 60676-86-0 0.602 41.90 54.07 419084 540754

leadfinish non noble metal tin 7440-31-5 0.033 2.33 2.33 23304 23304

plating noble metal silver 7440-22-4 0.025 1.73 1.73 17338 17338

*deviation < 10% Sum in total: 100,00 1000000

Important Remarks:

Infineon Technologies AG provides full material declaration based on information provided by third parties and

has taken and continues to take reasonable steps to provide representative and accurate information.

Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be

proprietary, and thus CAS numbers and other limited information may not be available for release.

All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any

time due to technical requirements and development without notification.

Company Infineon Technologies AG

Address 81726 München

Internet www.infineon.com