1.
2.
3.
Material Content Data Sheet
Sales Product Name ESD5V3U4RRS H6327 Issued 29. August 2013
MA# MA000844964
Package PG-SOT363-6-4 Weight* 6.27 mg
Construction Element Material Group Substances
CAS#
if applicable
Weight
[mg]
Average
Mass
[%]
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
chip noble metal gold 7440-57-5 0.005 0.07 747
non noble metal arsenic 7440-38-2 0.000 0.00 7
inorganic material silicon 7440-21-3 0.024 0.39 0.46 3872 4626
leadframe inorganic material silicon 7440-21-3 0.001 0.01 92
non noble metal titanium 7440-32-6 0.003 0.05 458
non noble metal chromium 7440-47-3 0.009 0.14 1375
non noble metal copper 7440-50-8 2.860 45.64 45.84 456450 458375
wire non noble metal copper 7440-50-8 0.015 0.23 0.23 2322 2322
encapsulation organic material carbon black 1333-86-4 0.031 0.49 4911
plastics epoxy resin - 0.662 10.56 105585
inorganic material silicondioxide 60676-86-0 2.385 38.06 49.11 380596 491092
leadfinish non noble metal tin 7440-31-5 0.213 3.40 3.40 34032 34032
plating noble metal silver 7440-22-4 0.060 0.96 0.96 9553 9553
*deviation < 10% Sum in total: 100,00 1000000
Important Remarks:
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company Infineon Technologies AG
Address 81726 München
Internet www.infineon.com