Material Content Data Sheet

Sales Product Name ESD5V3U4U-HDMI E6327 Issued 29. August 2013

MA# MA000491226

Package PG-TSLP-9-1 Weight* 1.58 mg

Construction Element Material Group Substances

CAS#

if applicable

Weight

[mg]

Average

Mass

[%]

Sum

[%]

Average

Mass

[ppm]

Sum

[ppm]

chip non noble metal tin 7440-31-5 0.001 0.09 882

noble metal gold 7440-57-5 0.005 0.34 3420

inorganic material silicon 7440-21-3 0.040 2.53 2.96 25341 29643

leadframe non noble metal nickel 7440-02-0 0.330 20.89 20.89 208863 208863

wire noble metal gold 7440-57-5 0.043 2.72 2.72 27161 27161

encapsulation organic material carbon black 1333-86-4 0.011 0.68 6814

plastics epoxy resin - 0.146 9.20 91992

inorganic material silicondioxide 60676-86-0 0.922 58.26 68.14 582612 681418

leadfinish noble metal gold 7440-57-5 0.032 2.01 2.01 20097 20097

plating noble metal silver 7440-22-4 0.052 3.28 3.28 32818 32818

*deviation < 10% Sum in total: 100,00 1000000

Important Remarks:

Infineon Technologies AG provides full material declaration based on information provided by third parties and

has taken and continues to take reasonable steps to provide representative and accurate information.

Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be

proprietary, and thus CAS numbers and other limited information may not be available for release.

All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any

time due to technical requirements and development without notification.

Company Infineon Technologies AG

Address 81726 München

Internet www.infineon.com