3DDS-0728-3  Oct 2021

Page 1 / 42

This document is 3D PLUS property, it not may be used by or communicated to third parties without prior written authorization.

SPI NOR FLASH

128 Mbit SPI TMR NOR Flash

3DFS128M01VS2728

Datasheet

PRODUCT OVERVIEW

The 3DFS128M01VS2728 is an embedded TMR

128 Mbit SPI NOR Flash.

This latch-up immune memory is radiation

hardened by design with a protection against

potential SEE ensured by TMR mitigation

electronics, and an enhanced TID performance

controlled by an embedded power on/off switch.

This device is designed and manufactured by 3D

PLUS using its space qualified stacking

technology process and manufacturing line based

in France.

The memory module is available in a small

dimension (SOP 20) package, optimized for

minimal PCB real estate for Space applications.

Its memory density, its guaranteed data retention,

its SEL immunity, SEE mitigation operations and

space-qualified technology make it the ideal

memory device for SRAM-based FPGA

configuration. The device has also the capability

to be easily switched-off after the boot code has

been loaded in order to save the application

power.

APPLICATIONS

 FPGA configuration bitstream

 Boot code storage for microcontrollers

and microprocessors

KEY BENEFITS

 High density

 Area saving

 Radiation guarantee

KEY FEATURES

PERFORMANCES

 128 Mbit density

 Single supply voltage: 3.3 V

 Triple Modular Redundancy (TMR)

integrated

 Enhanced TID implementation

 Supports standard SPI, up to 40 MHz

 More than 100,000 erase/program cycles

 More than 20-year data retention

 Program 1 to 256 bytes per page

 Program/Erase Suspend & Resume

 Continuous Read 8/16/32/64-byte burst

 Selectable burst length

 Available Temperature Range: 0°C to

+70°C, -40°C to +85°C, -55°C to +125°C

 ITAR free

 Qualified for Space Applications

SPACE QUALIFICATION

 Qualified with 3D PLUS ESA certification per

ESCC 2566001,

 Up to NASA Level 1,

 High Longevity and Reliability,

 Flight heritage : 3D PLUS expertise in space

memories for more than 20 years

RADIATION TOLERANCE

 TID > 40 krad(Si) (off)

 SEL LET > 62.5 MeV.cm²/mg

 SEE mitigated by design

SPI NOR FLASH

128 Mbit SPI TMR NOR Flash

3DFS128M01VS2728

Page 2 / 42

3DDS-0728-3  Oct 2021

This document is 3D PLUS property, it not may be used by or communicated to third parties without prior written authorization.

TABLE OF CONTENT

PRODUCT OVERVIEW............................................................................................................................. 1

APPLICATIONS........................................................................................................................................ 1

KEY BENEFITS......................................................................................................................................... 1

KEY FEATURES....................................................................................................................................... 1

PERFORMANCES ................................................................................................................................ 1

SPACE QUALIFICATION......................................................................................................................1

RADIATION TOLERANCE....................................................................................................................1

1. DOCUMENTS .................................................................................................................................... 6

1.1 APPLICABLE DOCUMENTS......................................................................................................6

1.2 REFERENCE DOCUMENTS ..................................................................................................... 6

1.3 ACRONYMS............................................................................................................................... 6

2. GENERAL DESCRIPTION ................................................................................................................ 7

2.1 DESCRIPTION ........................................................................................................................... 7

2.2 TYPE VARIANTS ....................................................................................................................... 8

2.3 PIN DESCRIPTION .................................................................................................................... 8

2.4 RADIATION PERFORMANCES................................................................................................. 9

3. NOR FLASH OPERATIONS.............................................................................................................. 10

3.1 READ OPERATIONS ................................................................................................................. 11

3.1.1 Normal Read (NORD, 03h)................................................................................................. 11

3.1.2 Fast Read (FRD, 0Bh) ........................................................................................................ 12

3.2 PROGRAM OPERATIONS......................................................................................................... 13

3.2.1 Write Enable (WREN, 06h)................................................................................................. 13

3.2.2 Write Disable (WREN, 04h) ................................................................................................ 14

3.2.3 Page Program (PP, 02h)..................................................................................................... 14

3.3 ERASE OPERATIONS............................................................................................................... 15

3.3.1 Sector Erase (SER, D7h/20h)............................................................................................. 15

3.3.2 Block Erase (BER32K, 52h / BER64K, D8h)...................................................................... 16

3.3.3 Chip Erase (CER, C7h/60h)................................................................................................17

3.4 REGISTER ACCESS..................................................................................................................18

3.4.1 Write Status Register (WRSR, 01h).................................................................................... 18

3.4.2 Read Status Register (RDSR, 05h).................................................................................... 18

3.4.3 Write Function Register (WRFR, 42h)................................................................................ 20

3.4.4 Read Function Register (RDFR, 48h)................................................................................. 20

3.4.5 Set Read Parameters (SRP, C0h)...................................................................................... 20

3.5 PROGRAM/ERASE SUSPEND AND RESUME ........................................................................ 21

3.5.1 Program/Erase Suspend (PERSUS, 75h) ..........................................................................21

3.5.2 Program/Erase Resume (PERRSM, 7Ah).......................................................................... 21

3.6 SOFTWARE RESET: RESET ENABLE (RSTEN, 66H) AND RESET (RST, 99H).................... 22

3.7 DEEP POWER DOWN............................................................................................................... 22

3.7.1 Enter Deep Power Down (DP, B9h)....................................................................................22

3.7.2 Release Deep Power Down (RDPD, ABh) .........................................................................23

3.8 HOLD.......................................................................................................................................... 24

3.9 NO OPERATION (NOP, 00H) ....................................................................................................24

3.10 SECURITY INFORMATION ....................................................................................................... 24

3.10.1 Information Row Erase (IRER, 64h) ...................................................................................24

3.10.2 Information Row Program (IRP, 62h).................................................................................. 25

3.10.3 Information Row (IRRD, 68h)..............................................................................................25