Substances Data Sheet of Raw Material
Table 1:
COMPANY:
CONTACT:
E-MAIL:
PHONE:
ASSEMBLY SITE :
PACKAGE :
Table 2:
Element Wt
(A)
Element Wt Wt % ppm
(%) (mg)
Of Total Unit Wt
Wafer TSMC Si Silicon 7440-21-3 100.00% 0.3500 2.3958 23958 0.350
Cu 7440-50-8
92.43% 4.6677 31.9510 319510
Fe 7439-89-6 2.35% 0.1187 0.8123 8123
Pb 7439-92-1 0.01% 0.0005 0.0035 35
P 7723-14-0 0.08% 0.0040 0.0277 277
Zn 7440-66-6 0.13% 0.0066 0.0449 449
Ag 7440-22-4 5.00% 0.2525 1.7284 17284
Cu 7440-50-8 93.25% 4.7091 32.2344 322344
Fe 7439-89-6 2.50% 0.1263 0.8642 8642
P 7723-14-0 0.10% 0.0051 0.0346 346
Zn 7440-66-6 0.10% 0.0051 0.0346 346
Pb 7439-92-1 0.05% 0.0025 0.0173 173
Silver 7440-22-4 4.00% 0.2020 1.3827 13827
Silica, crystalline
14808-60-7
42.50%
0.0166 0.1135 1135
Epoxy resin
TS ref# 10030 25.00%
0.0098 0.0667 667
Epoxy resin TS ref# 10114 15.00%
0.0059 0.0400 400
Epoxy resin modifier TS ref# 10038 15.00%
0.0059 0.0400 400
Amine TS ref# 10039 2.50%
0.0010 0.0067 67
Gold Wire Heraeus HA Aurum 7440-57-5 100.00% 0.18 1.2321 12321 0.18
Solid Epoxy Resin Trade Secret 10.00% 0.8320 5.6951 56951
Phenol Resin Trade Secret 10.00% 0.8320 5.6951 56951
Fused Silica 60676-86-0 62.00% 5.1584 35.3097 353097
Metal Hydro Oxide Trade Secret 15.00% 1.2480 8.5427 85427
Carbon Black 1333-86-4 0.50% 0.0416 0.2848 2848
Crystalline Silica 14808-60-7 2.50% 0.2080 1.4238 14238
Plating
云南锡业
Pure Tin Tin 7440-31-5 100.00% 0.6700 4.5862 45862 0.670
Total=14.609
5.050
Remark: The material composition of the following product is based on MSDS reports provided by supplier. Some information in MSDS reports is proprietary, so its CAS No.
can't be published.
kangqiang
Lead
Frame(Backup)
A194
GE1030S
8.320
0.039
Weight(mg)
Lead Frame
Mold
Compound
SD
Epoxy
Henkel
8290
5.050
Material
Supplier
Type
Composition
CAS No.
AAM
A194
Contact Information
SG MICRO CORP
Frank Zhu
Frank _zhu@sg-micro.com
86-10-88825716/17
Product Information
JCET
SOT-23-5