Features Pin Description
• 30V/70A,
R
DS (ON)
=3mΩ(Typ.)@V
GS
=10V
R
DS (ON)
=4.5mΩ(Typ.)@V
GS
=4.5V
• Super High Dense Cell Design
• Ultra Low On-Resistance
• 100% avalanche tested
• Lead Free and Green Devices Available (RoHS Compliant)
Absolute Maximum Ratings
Symbol Parameter Rating Unit
Common Ratings
(T
C
=25°C Unless Otherwise Noted)
V
DSS
Drain-Source Voltage 30
V
V
GSS
Gate-Source Voltage ±20
T
J
Maximum Junction Temperature 175 °C
T
STG
Storage Temperature Range -55 to 175 °C
I
S
Diode Continuous Forward Current T
C
=25°C 70 A
Mounted on Large Heat Sink
I
DP
①
300μs Pulse Drain Current Tested T
C
=25°C 280 A
I
D
②
Continuous Drain Current(V
GS
=10V)
T
C
=25°C 70
A
T
C
=100°C 49
P
D
Maximum Power Dissipation
T
C
=25°C 71
W
T
C
=100°C
36
R
q
JC
Thermal Resistance-Junction to Case 2.1 °C/W
R
q
JA
Thermal Resistance-Junction to Ambient 100 °C/W
Drain-Source Avalanche Ratings
E
AS
③
Avalanche Energy, Single Pulsed 196 mJ
Ruichips Semiconductor Co., Ltd
Rev. B– AUG., 2015
1 www.ruichips.com