The NXP EdgeReady i.MX RT117F MCU-based solution for 3D
face recognition enables developers to quickly and easily add
3D face recognition with advanced liveness detection to their
products, with the confidence that it will work in even the most
challenging outdoor lighting conditions and can resist the most
sophisticated spoofing attacks. 3D liveness detection defeats
spoofing attempts using photographs or 3D models, and uses
a high performance 3D structured light camera module (SLM)
with an optional low cost CMOS sensor based RGB camera,
without requiring the use an expensive, power hungry, Linux
based MPU with long boot times. The development kit for this
solution, SLN-VIZN3D-IOT, comes with fully integrated turnkey
software, for quick out-of-the-box operation, minimizing time
to market, risk and development effort. Face recognition and
liveness detection is done entirely offline, on the i.MX RT117F
MCU, without using the cloud, addressing the privacy concerns
of some consumers and eliminating the latency associated
with cloud-based implementations. The solution includes an
available remote registration capability to allow end users to
register their faces from mobile devices.
TARGET APPLICATIONS
Smart home, smart building and smart industrial applications
that need secure user identification and authentication in
even the most challenging lighting conditions
• Smart Door Locks (homes and hotels)
– Optimized for low power consumption to maximize
battery life
– BLE connectivity for OTA software updates and face
template updates of remotely registered users
– Supports up to 100 registered users
• Access control (smart building, smart industrial)
– Wi-Fi connectivity for OTA software updates & face
template updates of remotely registered users
– Supports up to 3000 registered users
i.MX RT117F 3D FACE RECOGNITION CROSSOVER
PROCESSOR OVERVIEW
The i.MX RT117F is an EdgeReady member of the i.MX
RT1170 family of crossover MCUs, targeting low cost
embedded secure face recognition applications. It features
NXP’s advanced implementation of the Arm
®
Cortex
®
-M7
core, which operates at speeds up to 1 GHz to provide high
performance and real-time response. In addition to the 3D face
recognition capability, the i.MX RT117F has plenty of available
CPU and memory resources, and includes many integrated
peripherals, making it suitable to be the main controller in
many different product categories, running the access control
device’s application code concurrently with face recognition.
The i.MX RT117F MCU is licensed to run NXP’s facial
biometric authentication library which includes (see software
block diagram section for more information):
• Camera drivers, image capture and pre-processing
• Face detection, tracking, alignment and recognition (with
quantified results and confidence measure)
• Liveness detection for 2D and 3D anti-spoofing
• Built-in security, bootloader and application validation
• All drivers, inc. Bluetooth™ Low Energy and Wi-Fi
(coming soon)
• OTW Client with signing scripts, rollback & image
redundancy
• USB mass storage device updates
• Factory Automation Scripts
• Supported by MCUXpresso SDK, IDE and Config Tools
NXP EdgeReady i.MX RT117F
MCU-BASED SOLUTION FOR 3D
FACE RECOGNITION
FACT SHEET
EdgeReady
HARDWARE BLOCK DIAGRAM
SOFTWARE BLOCK DIAGRAM
www.nxp.com
NXP and the NXP logo are trademarks of NXP B.V. All other product or service names are the property of their respective owners.
© 2021 NXP B.V.
Document Number: iMXRT117FFS REV 0
I.MX RT117F SOLUTION FOR 3D FACE RECOGNITION DEVELOPMENT KIT (SLN-VIZN3D-IOT) HARDWARE BLOCK DIAGRAM
NXP Technology Non NXP Technology Optional Technology
CAMERA INTERFACE
GPIO x4
MQS
1
32 MB QSPI
NOR FLASH
32 MB SDRAM
PC200
QSPI SEMC
Antenna
WHITE LED
PWM
LED DRIVER
BUCK BOOST
REG
I
2
C
GPIO
LOW COST
LDO(s)
IMAGE SENSOR
(CMOS RGB)
USB
CONNECTOR
BATTERIES
6 V DC-IN
BLE Radio
QN9090
24 MHz
CRYSTAL
IMAGE SENSOR
3D-SLM
I
2
C
USER/RESET
SWITCH
MCU
i.MX RT117F
2W Speaker
AUDIO
AMPLIFIER
UART SPI I
2
C ADC PWM GPIOs
3.3 V BUCK
REG
FlexIO
DISPLAY INTERFACE
COLOR
DISPLAY
EXPANSION
HEADER
UART
GPIO
GPIO
PIR
SENSOR
RGB
STATUS LED
GPIO x5
GPIO
GPIO x3
GPIO
i.MX RT117F SOLUTION FOR 3D FACE RECOGNITION SOFTWARE BLOCK DIAGRAM
Driver Layer
Framework
Face Detection
NXP Facial Biometric Authentication Runtime Library
Middleware
NXP Facial Biometric Authentication API
Application Control Modules
Over the Wire Update (OTW)
Boot Loader
Drag and Drop Update
Camera Manager
Hardware Abstraction Layer
File System
Serial
Manager
NXP MCU inference engine
Face Alignment
Face Quality
2D Liveness Algorithm
3D Liveness Algorithm
Face Recognition
Memory Management
MQS
LCDIF
MIPI-DSI
MIPI-DSI
UART
GPIO
FlexIO
CSI
I
2
C
PWM
Button SpeakerLEDBLE/BTDisplay Camera
GUI
Controller
Audio Feedback
Controller
BLE
Controller
Onboarding
Handler
Power
Controller
FreeRTOS
Mini CV
Display Manager Power Manager Input Manager Output Manager Algorithm Manager
Camera Manager HAL Display Manager HAL Power Manager HAL Input Manager HAL Output Manager HAL Algorithm Manager HAL
PART NUMBER DESCRIPTION FEATURES DIMENSIONS
SLN-VIZN3D-IOT MCU-based 3D face recognition
solution evaluation and
development kit
• NXP EdgeReady turnkey software solution for 3D face
recognition with liveness detection
• i.MX RT117F 3D face recognition crossover processor
• 3D Structured Light Module (SLM) Camera
• RGB Camera
• 2.4” TFT display (240x320)
• Audio amplifier and speaker
• 32 MB QSPI NOR Flash
• 32 MB SDRAM
• Bluetooth
®
Low Energy (BLE) 5.0
• Dual band Wi-Fi + BLE 5.1
• MikroE™ Click expansion header
173 x 92 x 20 mm
(maximum)
MIMXRT117FDVMAA i.MX RT117F 3D face recognition
crossover MCU
• 1 GHz Arm Cortex-M7 MCU with runtime license for
3D face recognition software
• 2 MB on-chip RAM
14 x 14 x 1.37 mm
(LFBGA289)
QN9090HN/001K
(OM15069-2 module)
Bluetooth
®
Low Energy (BLE) 5.0
Wireless MCU
• 48 MHz Cortex-M4
• 640 kB Flash, 152 kB RAM, 128 kB ROM
Device: 6 x 6 x 0.85 mm
(TQFP-40)
Module: 13 x 30 x 2 mm
IW416UK/A1CZ
(AW-AM510 module)
IW416: 2.4/5 GHz Dual-Band 1x1
Wi-Fi
®
4 (802.11n) + BLE5.1
• 802.11 a/b/g/n dual band
• Up to MCS7 data rates (150 Mbit/s)
• DRCS for simultaneous 2.4 GHz & 5 GHz operation
• 802.15.4, LTE, etc. coexistance
• WPA3, WPA2, WPA2 & WPA mixed mode, WEP
Device: 3.95 x 3.565 x
0.495 mm (WLCSP76)
Module: 12 x 12 x 1.85
mm