SGM6601 Low-Power DC-DC Boost Converter
2
FEBRUARY 2014
SG Micro Corp
www.sg-micro.com
PACKAGE/ORDERING INFORMATION
MODEL
PACKAGE
DESCRIPTION
TEMPERATURE
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
SGM6601
TDFN-2×2-6L
-40℃ to +85℃
SGM6601YTDI6G/TR
Tape and Reel, 3000
TSOT-23-5
-40℃ to +85℃
SGM6601YTN5G/TR SG4XX
Tape and Reel, 3000
MARKING INFORMATION
NOTE: XXXX = Date Code. XX = Date Code
For example
:
SG4CA (2012, January)
SG4 X X
Date code - Year ("A" = 2010, "B" = 2011 …)
Date code - Month ("A" = Jan. "B" = Feb. … "L" = Dec.)
Chip I.D.
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
ABSOLUTE MAXIMUM RATINGS
Input Supply Voltage.............................................. -0.3V to 6V
EN and FB Pin Voltages........................................ -0.3V to V
IN
SW Switch Voltage............................................................ 40V
Operating Temperature Range.........................-40℃ to +85℃
Junction Temperature.....................................................150℃
Storage Temperature Range..........................-65℃ to +150℃
Package Thermal Resistance
TDFN-2×2-6L, θ
JA
.................................................... 124℃/W
TSOT-23-5, θ
JA
........................................................ 250℃/W
Lead Temperature (Soldering, 10s) .............................. 260℃
ESD Susceptibility
HBM ............................................................................. 4000V
MM ................................................................................. 200V
OVERSTRESS CAUTION
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure
to
absolute maximum rating conditions for extended periods
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions section
is not implied.
ESD SENSITIVITY CAUTION
This integrated circuit can be damaged if ESD protections are
not considered carefully. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failure
to observe proper handling
and installation procedures
can cause damage. ESD damage can range from subtle
performance
degradation to
complete device failure. Precision
integrated circuits may be more susceptible to damage
because even small parametric changes could cause the
device not to meet the published specifications.
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit
design, or specifications
without prior notice.