SGM2553E
Precision Adjustable Current
Limited Power Distribution Switch
SG Micro Corp
www.sg-micro.com
APRIL 2018 – REV. A
GENERAL DESCRIPTION
The SGM2553E is a single channel power distribution
switch. The switch operates from a wide range of 2.5V
to 5.5V supply voltage, and is controlled by the EN pin.
A 90mΩ low R
ON
N-MOSFET is integrated. The small
size and quiescent current make the device very suitable
for space limited, battery-powered applications.
A number of protection features are provided in the
device including soft-start, over-current protection,
adjustable current limit and thermal shutdown. This
device provides a programmable current limit threshold
between 100mA and 200mA through the R
ILIM
. The
internal reverse-voltage function will protect devices on
the input side of the switch. Fault conditions are
indicated by the nFAULT pin. The SGM2553E has
quick output discharge function in disable status.
SGM2553E is available in a Green TDFN-2×2-6L
package. It is rated over the -40 to +85 temperature
range.
FEATURES
Input Voltage Range: 2.5V to 5.5V
On-Resistance: 90mΩ (TYP)
Continuous Current: 0.2A (MAX)
Meets USB Current Limit Requirements
Programmable Current Limit: 100mA to 200mA
Protection Features
No Reverse Leakage Current of High-side
MOSFET
Reverse Voltage Protection
Soft-Start
Thermal Shutdown
Quick Output Discharge
Evaluated to IEC 60950-1, Ed 2, Am1, Annex CC,
Test Program 1 with CB Report
Available in a Green TDFN-2×2-6L Package
APPLICATIONS
USB Ports/Hubs
Digital TV
Set-Top Boxes
VOIP Phones
Precision Adjustable Current
SGM2553E Limited Power Distribution Switch
2
APRIL 2018
SG Micro Corp
www.sg-micro.com
PACKAGE/ORDERING INFORMATION
MODEL
PACKAGE
DESCRIPTION
SPECIFIED
TEMPERATURE
RANGE
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
SGM2553E TDFN-2×2-6L
-40 to +85
SGM2553EYTDI6G/TR
SJ6
XXXX
Tape and Reel, 3000
MARKING INFORMATION
NOTE: XXXX = Date Code.
Date Code - Year
Date Code - Week
Serial Number
Y Y Y
X X X X
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
ABSOLUTE MAXIMUM RATINGS
VIN, VOUT, EN, ILIM and nFAULT to GND .......... -0.3V to 6V
Continuous Output Current ......................... Internally Limited
Continuous nFAULT Sink Current ................................. 25mA
ILIM Source Current ....................................................... 1mA
Package Thermal Resistance
TDFN-2×2-6L, θ
JA
.................................................... 160/W
Junction Temperature ................................................. +150
Storage Temperature Range ......................... -65 to +150
Lead Temperature (Soldering, 10s) ............................ +260
ESD Susceptibility
HBM ............................................................................. 2000V
MM ................................................................................. 200V
RECOMMENDED OPERATING CONDITIONS
Input Voltage Range ........................................... 2.5V to 5.5V
Enable Voltage Range ........................................... 0V to 5.5V
Continuous Output Current Range ........................ 0A to 0.2A
Current Limit Threshold Resistor Range ...... 200kΩ to 390
Continuous nFAULT Sink Current Range ......... 0mA to 10mA
Minimum Input Decoupling Capacitance ...................... 0.1μF
Operating Temperature Range ...................... -40 to +85
OVERSTRESS CAUTION
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure
to
absolute maximum rating conditions for extended periods
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions section
is not implied.
ESD SENSITIVITY CAUTION
This integrated circuit can be damaged if ESD protections are
not considered carefully. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failure
to observe proper handling
and installation procedures
can cause damage. ESD damage can range from subtle
performance
degradation to
complete device failure. Precision
integrated circuits may be more susceptible to damage
because even small parametric changes could cause the
device not to meet the published specifications.
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit
design, or specifications
without prior notice.