Diodes Inc. Material Data Sheet

Rev: May 2009

Part Number: p = package designator

Weight (mg): 16.2468

Element Material Group Materials CAS (if applicable)

Average mass

homogeneous

Materal(%)

Percent

of whole

(%)

Mass (mg)

ppm

Homogeneous

Material

ppm overall

Chip Silicon w/Metal

Doped Silicon

7440-21-3 100.00% 4.78 0.7763

1000000 47782

Cu 7440-50-8 95.90%

959000 360395

Si 7440-21-3 0.73%

7250 2725

Ni 7440-02-0 3.20%

32000 12026

Mg 7439-95-4 0.18%

1750 658

Intenal plating

Ni 7440-02-0 100.00% 0.87 0.1412

1000000 8691

middle plating

Pd 2023568 100.00% 0.08 0.0128

1000000 788

outer plating

Au 7440-57-5 100.00% 0.02 0.0026

1000000 160

Bond Wire Gold Wire Gold 7440-57-5 100.00% 1.75 0.2838

1000000 17468

Silica fused 60676-86-0

93.50%

935000 492252

Epoxy resin ------

3.00%

30000 15794

Phenol resin ------

3.00%

30000 15794

Carbon Black 1333-86-4

0.50%

5000 2632

Ag 7440-22-4 80.00% 800000 18268

palladium compound ---- 0.15% 1500 34

2,6-Di-tert-butyl-p-cresol 128-37-0 0.01% 50 1

Hydroquinone 123-31-9 0.00% 1 0

Acrylate ---- 15.84% 158449 3618

Bismaleimide resin ---- 3.00% 30000 685

Polymer of polybutadiene and anlydride

---- 1.00% 10000 228

Total 100.00 16.2468 1000000

Tolerance ±10%

Organic tin compounds

Asbestos Ozone Depleting Substances - Class I (CFCs, HBFCs, etc.)

Antimony Compounds Ozone Depleting Substances - Class II (HCFCs)

Azo compounds Perfluorooctane Sulphonate (PFOS) or related compounds

Cadmium and cadmium compounds Polybrominated biphenyls (PBB) and Polybrominated diphenyl ethers (PBDE) including DecaBDE

Certain Shortchain Chlorinated Paraffins Polychlorinated Biphenyls (PCBs)

Chlorinated organic compounds Polychlorinated Naphthalenes ( > 3 chlorine atoms)

Dimethyl fumarate Radioactive Substances

Halogens Red Phosphorous

Hexavalent chromium compounds Tributyl Tin (TBT) and Triphenyl Tin (TPT)

Lead and lead compounds Tributyl Tin Oxide (TBTO)

Mercury and mercury compounds

REACH SVHCs and other Substances of Concern: 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene)

Anthracene Bis (2-ethyl(hexyl)phthalate) (DEHP)

4,4'- Diaminodiphenylmethane Hexabromocyclododecane (HBCDD)

Dibutyl phthalate Alkanes, C10-13, chloro (Short Chain Chlorinated Paraffins)

Cyclododecane Bis(tributyltin)oxide

Cobalt dichloride

Lead hydrogen arsenate

Diarsenic pentaoxide Triethyl arsenate

Diarsenic trioxide Benzyl butyl phthalate

Sodium dichromate, dihydrate

Methylene Chloride

Beryllium, Beryllium Alloys and Compounds Trichloroethene

Hydrazine Methyl Ethyl Ketone

Tetrachloroethylene Xylenes

Toluene

Toluene Diisocyanate

This product or product family does not contain any of the following substances except as CURRENTLY exempted by ELV II and RoHS and reported above:

SBR05M100BLP-p SBR05M60BLP-p

37.58

52.65

SBR DFN3030-4 Package

6.1056

8.5535

C7025

EME-G770HCD

See Data Sheet

Leadframe

Encapsulation

This data is based on information provided by our suppliers. We believe it to be correct but do not routinely validate it by measurement. It is for guidance only and Diodes Inc. does not

guarantee its absolute accuracy or completeness

* The Silicon Chip is doped at atomic levels with trace amounts of elements that may include Phosphorus, Boron, Arsenic, and other elements. Metalization may include Titanium,

Nickel, Aluminum, Silver or Gold These substances are not reported where their concentration is less than the minimum reportable level per the guidelines specified in the Tables of

EIA JIG-101, Material Composition Declaration for Electronic Products

Die Attach Epoxy QMI519 2.28 0.371

Leadframe Plating