eGaN® FET DATASHEET
EPC23101
EPC – POWER CONVERSION TECHNOLOGY LEADER | EPC-CO.COM | ©2021 | | 2
General Description
The EPC23101 ePower
TM
IC integrates a half-bridge gate driver with an
internal high side FET. It is designed as part of a chipset with a companion
low side eGaN® FET such as the EPC2302. Integration is implemented
using EPC’s proprietary GaN IC technology. The high side monolithic
chip integrates input logic interface, level shifting, bootstrap charging
and gate drive buer circuits along with a high side eGaN output FET.
The low side output FET is driven by the gate driver output of the GaN IC
to congure a half-bridge power stage.
The on-chip gate drive buers practically eliminate eects of common
source inductance and gate drive loop inductance. Power loop inductance
is minimized by compatible high side to low side pinout conguration
that facilitates optimal layout technique. Switching times are tuned by
external resistors to achieve 1–3 ns rise and fall times from 0–48 V at full
load current. Over-voltage spikes can be controlled to less than +10 V
above rail and –10 V below ground during hard switching transitions by
choosing the tuning resistors, R
BOOT
and R
DRV
.
The EPC23101 IC only requires an external 5 V V
DRV
power supply. Internal
low side and high side power supplies, V
DD
and V
BOOT
, are generated
from the external supply via a series connected switch. The internal
supplies can be cut o to save quiescent power by turning o the switch
with 5 V applied to the EN pin.
Figure 2: Functional Block Diagram
The charging path for the oating bootstrap supply is activated with L
SIN
logic. It uses eGaN FET as the series switch that minimizes power losses
by eliminating reverse recovery. This synchronous bootstrap charging
circuit also minimizes voltage drop in the charging path.
Robust level shifters from low side to high side channels are designed to
operate correctly even at large negative clamped voltage and to avoid
false trigger from fast dv/dt transients including those driven by external
sources or other phases.
Protection is provided by high side and low side under-voltage lockout
to keep both FETs o at low supply voltages. If the supply voltages drop
even lower or are lost while V
IN
is active at greater than 10 V, another
active pull-down circuit is used with biasing from V
IN
to prevent
destructive turn-on of both FETs from gate to drain leakage..
The EPC23101 IC is capable of interfacing to digital controllers that use
standard 3.3 V or 5 V CMOS logic levels. Separate and independent high
side and low side logic control inputs allow external controllers to set
xed or adaptive dead times for optimal operating eciency. Cross
conduction prevention logic keeps both FETs o when logic inputs are
both high at the same time.
The FET gate drive voltages are derived from the internal low side and
high side power supplies. Full gate drive voltages are only available after
the HS
IN
and LS
IN
PWM inputs start to operate for a few cycles.
LS
IN
HS
IN
V
DD
C
DD
V
DRV
C
DRV
C
BOOT
EPC23101
EPC2302
C
IN
V
IN
150 k
SW
GND
GND
V
DD
V
IN
V
Boot
V
DRV
R
Boot
R
DRV
LG
OUT
Sync
boot
Logic
+
UVLO
+
Cross-
over
LO
Level
shift
Delay
match
PGND
SW
VIN
1
3
5
14
6
7
8
13
10, 12
9, 11
4
2
Enable
logic
Gate
driver
EN
Gate
driver
High side