Jun. 2, 2021 © 2019 Transphorm Inc. Subject to change without notice.
tp65h150g4lsg.0v2 1
TP65H150G4LSG
650V SuperGaN
®
GaN FET in PQFN (source tab) Preliminary Datasheet
Key Specifications
V
DS
(V) min 650
V
DSS(TR)
(V) max 800
R
DS(on)
(mΩ) max* 180
Q
RR
(nC) typ 40
Q
G
(nC) typ 8
* Dynamic R
DS(on)
; see Figures 18 and 19
Features
• Gen IV technology
• JEDEC-qualified GaN technology
• Dynamic R
DS(on)eff
production tested
• Robust design, defined by
— Wide gate safety margin
— Transient over-voltage capability
• Very low Q
RR
• Reduced crossover loss
• RoHS compliant and Halogen-free packaging
Benefits
• Achieves increased efficiency in both hard- and soft-
switched circuits
— Increased power density
— Reduced system size and weight
— Overall lower system cost
• Easy to drive with commonly-used gate drivers
• GSD pin layout improves high speed design
Applications
• Consumer
• Power adapters
• Low power SMPS
• Lighting
Description
The TP65H150G4LSG 650V, 150mΩ Gallium Nitride (GaN)
FET is a normally-off device. It combines state-of-the-art high
voltage GaN HEMT and low voltage silicon MOSFET
technologies—offering superior reliability and performance.
The Gen IV SuperGaN
®
platform uses advanced epi and
patented design technologies to simplify manufacturability
while improving efficiency over silicon via lower gate charge,
output capacitance, crossover loss, and reverse recovery
charge.
Related Literature
• AN0003: Printed Circuit Board Layout and Probing
• AN0007: Recommendations for Vapor Phase Reflow
• AN0009: Recommended External Circuitry for GaN FETs
• AN0012: PQFN Tape and Reel Information
Product Series and Ordering Information
Part Number Package
Package
Configuration
TP65H150G4LSG-TR
*
8x8 PQFN Source
Cascode Device Structure Cascode Schematic Symbol
TP65H150G4LSG
PQFN
(top view)
* “-TR” suffix refers to tape and reel. Refer to AN0012 for details.
S
G
D