High integration and low-power operation

in the 88MW320/322 WLAN microcontroller

system-on-chip (SoC), making it an ideal

solution for low-cost, high efficiency smart

device, appliance, and energy applications.

PRODUCT OVERVIEW

Several features of the NXP 88MW320/322 SoC enable

low system costs and high WLAN protocol processing. For

example, the high degree of integration in the SoC requires

only one 3.3 V power input, a 38.4 MHz crystal and SPI

flash, while the RF path needs only a low-pass filter for

antenna connection.

Proven and mature IEEE 802.11n/g/b NXP technology

powers a full-featured WLAN subsystem in the SoC. This

WLAN subsystem integrates a WLAN MAC, baseband, and

direct-conversion RF radio with integrated PA, LINA and

transmit/receive switch. It also integrates a CPU subsystem

with integrated memory to run NXP WLAN firmware to

handle real-time WLAN protocol processing to offload many

WLAN functions from the main application CPU.

An Arm

Cortex

-M4F CPU that operates up to 200 MHz

powers the 88MW320/322 application subsystem. The

device supports an integrated 512 KB SRAM, 128 KB mask

ROM and a QSPI interface to external flash. An integrated

flash controller with a 32 KB SRAM cache enables execute

in place (XIP) support for firmware from flash.

The SoC is designed for low-power operation and includes

several low-power states and fast wake-up times. Multiple

power domains and clocks can be individually shut down

to save power. The SoC also has a high-efficiency internal

PA that can be operated in low-power mode to save power.

The microcontroller and WLAN subsystems can be placed

into low-power states, independently, supporting a variety

of application use cases. An internal DC-DC regulator

provides the 1.8 V rail for the WLAN subsystem.

The SoC provides a full array of peripheral interfaces

including SSP/SPI/I

S (3x), UART (3x), I

C (2x), general-

purpose timers and PWM, ADC, DAC, analog comparator,

and GPIOs. It also includes a hardware cryptographic

engine, RTC, and watchdog timer.

The 88MW322 SoC includes a high-speed USB On-The-

Go (OTG) interface to enable USB audio, video and other

applications.

A complete set of digital and analog interfaces enables

direct interfacing for I/O and avoids the need for external

chips. The application CPU can be used to support custom

application development and avoids the need for another

microcontroller or processor.

NXP

88MW32X 802.11N

WI-FI

MICROCONTROLLER SOC

FACT SHEET

88MW32X

www.nxp.com 2

APPLICATIONS

• Smart Home—smart outlet, light

switch, security camera, thermostat,

sprinkler controller, sensor, door lock,

door bell, garage door, security system

• Industrial—building automation,

smart lighting, Wi-Fi to other radio

bridge, point of sale (POS) terminals

• Smart Devices—coffee pot, rice

cooker, vacuum cleaner, air purifier,

pet monitor, weighing scale,

glucometer, blood pressure monitor,

fitness equipment

• Smart Appliances—refrigerator,

washer, dryer, oven range,

microwave, dishwasher, water heater,

air conditioner

• Smart Accessories—smart speakers,

headset, alarm clock, gaming

accessory, remote control

• Gateways—Bluetooth Smart Mesh

and other radios to Wi-Fi/IP network

KEY FEATURES

• Highly integrated SoC requiring very

few external components for a full

system operation

• Multiple low-power modes and fast

wake-up times

• Full-featured, single stream

802.11n/g/b WLAN

• High-efficiency PA with a low-power

(10 dB) mode

• Cortex-M4F application CPU for

applications with integrated 512 KB

SRAM and 128 KB mask ROM

• Flash controller with embedded 32

KB SRAM cache to support XIP from

external SPI flash

• Secure boot

• Full set of digital and analog I/O

interfaces

POWER MANAGEMENT

• Power modes—active, idle, standby,

sleep, shutoff, power-down

• Integrated high-efficiency buck

DC-DC converter

• Independent power domains

• Brown-out detection

• Integrated POR

• Wake-up through dedicated GPIO,

IRQ, and RTC

CHIP PACKAGE

• 88MW320—68-pin QFN, 8 x 8 mm

– USB OTG not supported

– 35 GPIOs

– 2 GPTs

• 88MW322—88-pin QFN, 10 x 10 mm

• – USB OTG supported

• – 50 GPIOs

• – 4 GPTs

TEMPERATURE

• Commercial: 0° to 70° C

• Extended: -30° to 85° C

• Industrial: -40° to 105° C

• Storage: -55° to 125° C

FACT SHEET 88MW32X

88MW32X BLOCK DIAGRAM

32 KB

SRAM

LDO18

LDO11

V11

Digital

Analog

I/O

Digital

Analog

I/O

Digital

Analog

I/O

Digital

Analog

I/O

Digital

Analog

I/O

Digital

Analog

I/O

QSPI

Code RAM0

Code RAM1

Data RAM0

APB0

APB1

Microcontroller

WLAN

Data RAM1

AHB Bus

Fabric

Arm

Cortex

-M4 Core

Flash/Cache

Controller

ROM

USB

Controller

PHY

AES/CRC

Security/Encryption

LNA

2.4 GHz

DMA

Controller

AHB

decode

SSP/SPI/I

ADC/T-Sens

DAC

ACOMP

PINMUX

UART

SSP/SPI/I

WDT

PMU

RTC

4k SRAM

UART

GPIO

Timer/PWM

X2/12

I/O Multiplexer

PLL

32 kHz GEN

32 MHz GEN

MPU

NVIC

JTAG

SWD

FPU

BUCK18

VDD Power

Management

V18

V11

LDO11

Feroceon

CPU

SRAM/

ROM

JTAG

802.11 MAC

Tx/Rx 1x1

SISO

802.11

Baseband

(DSSS/OFDM,

1x1 SISO)

Direct

Conversion

WLAN RF

1 x 1 SISO

T/R

Switch

88MW32X BLOCK DIAGRAM

PACKAGE FEATURE DIFFERENCES

Features 68-Pin 88-Pin

GPIO 35 total

GPIO_0 to GPIO_10

GPIO_16

GPIO_22 to GPIO_33

GPIO_39 to GPIO_49

50 total

GPIO_0 to

GPIO_49

USB 2.0

OTG

— 1

GPT 2 4

All I/O features are muxed on GPIOs, except WLAN RF

TX/RX, USB, reference clock, and reset functionality.