Order code: FLCORPORATE0121 For more information on ST products and solutions, visit www.st.com
© STMicroelectronics - January 2021 - Printed in the United Kingdom - All rights reserved
ST and the ST logo are registered and/or unregistered trademarks of STMicroelectronics International NV or its afliates in
the EU and/or elsewhere. In particular, ST and the ST logo are Registered in the US Patent and Trademark Ofce.
For additional information about ST trademarks, please refer to www.st.com/trademarks.
All other product or service names are the property of their respective owners.
Semiconductor solutions: one of the industry’s broadest
product portfolios
We create innovative semiconductor solutions based on:
Trends that drive our innovation
STMICROELECTRONICS
Our company at a glance
Our products and
solutions enable
customer innovation
Dedicated
Automotive ICs
Smart mobility Power and energy Internet of Things & 5G
Discrete &
Power Transistors
Analog, Industrial &
Power Conversion ICs
MEMS & Optical
sensing solutions
General Purpose MCUs
& MPUs,
Secure solutions
ASICs based on ST
proprietary technologies
Thinking differently about how we
move around, reducing pollution
and congestion through car
electrication and digitalization
More efcient power and energy
management to address increasing
global energy demand while
reducing the environmental impact
Transforming every area of our
lives and the objects we use with
billions of cloud-connected devices
for personal, business, and public
applications
Technology
We have a unique set of chip-manufacturing and packaging
technologies enabling solutions for the markets we serve.
Manufacturing facilities
We believe in the benets of owning manufacturing facilities
and operating them in close proximity and coordination with its
R&D operations.
MEMS for sensors
& Micro-actuators
Smart Power: BCD (Bipolar -
CMOS - Power DMOS)
FD-SOI CMOS
FinFET through Foundry
Discrete, Power MOSFET, IGBT
Silicon Carbide, Gallium Nitride
Analog & RF CMOS Vertical Intelligent Power
eNVM CMOS Optical sensing solutions
France (Crolles, Rousset, Tours) Singapore
Italy (Agrate, Catania) Malaysia (Muar)
Malta (Kirkop) China (Shenzhen)
Morocco (Bouskoura) Philippines (Calamba)
Packaging technologies
Leadframe – Laminate – Sensor module – Wafer level
Front End (Wafer processing)
Back End (Assembly and test)