________________________________________________________________________
DIC-034 R4
Page 1 of 6
Diodes Incorporated Rel Date: 2/8/2019
www.diodes.com
DATE: 5
th
December, 2019
PCN #:
2439
PCN Title: Qualification of "Diodes Technology (Cheng Du) Company Limited"
(CAT) as an Additional Assembly & Test Site, Using Gold Bond Wire,
and as an Additional Wafer Back Grinding and Back Metal Process
Source on Select MOSFET Products
Dear Customer:
This is an announcement of change(s) to products that are currently being
offered by Diodes Incorporated.
We request that you acknowledge receipt of this notification within 30 days of the
date of this PCN. If you require samples for evaluation purposes, please make a
request within 30 days as well. Otherwise, samples may not be built prior to this
change. Please refer to the implementation date of this change as it is stated in
the attached PCN form. Please contact your local Diodes sales representative to
acknowledge receipt of this PCN and for any sample requests.
The changes announced in this PCN will not be implemented earlier than 90
days from the notification date stated in the attached PCN form.
Previously agreed upon customer specific change process requirements or
device specific requirements will be addressed separately.
For questions or clarification regarding this PCN, please contact your local
Diodes sales representative.
Sincerely,
Diodes Incorporated PCN Team
________________________________________________________________________
DIC-034 R4
Page 2 of 6
Diodes Incorporated Rel Date: 2/8/2019
www.diodes.com
PRODUCT CHANGE NOTICE
PCN-2439 REV 1
Notification Date:
Implementation
Date:
Product Family: Change Type: PCN #:
5
th
December, 2019 5
th
March, 2020
Discrete
Semiconductors
Additional Assembly & Test Site/
Bond Wire Material /Back Grinding
and Back Metal Process Source
2439
TITLE
Qualification of "Diodes Technology (Cheng Du) Compan y Limited" (CAT) as an Additional Assembly & Test Site, Using Gold
Bond Wire, and as an Additional Wafer Back Grinding and Back Metal Process Source on Select MOSFET Products
DESCRIPTION OF CHANGE
This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes has qualified additional
Diodes Internal Assembly and Test site (CAT) in Chen gdu, Chin a, qua lified gold b ond wire, and qu alifi ed CAT as an additio na l
wafer back grinding and back metal process facility for select MOSFET products listed in different tabl es below.
Full electrical characterizatio n and high reliability testing h as been comple ted on representative part numbers to ensur e there
is no change to device functiona lity or electrical specifications in the datasheet. Refer to the attached qualification / reliability
report (embedded in this file).
IMPACT
Continuity of Supply. No change in datasheet parameters or product performance.
PRODUCTS AFFECTED
Table 1 - Affected Part List to add CAT as an additional Assembly & Test Site
Table 2 - Affected Part List to add CAT as an additional Assembly & Test Site and an additional wafer back grinding and back
metal process facility
Table 3 – Affected Part List to add CAT as an additional Assembly & Test Site using gold bond wire and an additional wafer
back grinding and back metal process facility
Table 4 – Marking Code Format for affected packages
Table 5 – Package Outline Dimension (POD) Format for affected packages
WEB LINKS
Manufacturer’s Notice:
https://www.diodes.com/quality/product-change-notices/diodes-product-change-notices/
For More Information Contact:
http://www.diodes.com/contacts
Data Sheet:
http://www.diodes.com/products
DISCLAIMER
Unless a Diodes Incorpo rated Sales representative is contacted in writing within 30 days of the posting of this notice,
all changes described in this announcement are considered approved.