SPF1
www.vishay.com
Vishay Electro-Films
Revision: 18-Feb-2021
1
Document Number: 61105
For technical questions, contact: efi@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Thin Film Metallized Plates - Custom Substrates
FEATURES
• Metalization on 1, 2, or 6 surfaces
• Various substrate materials
• Tantalum nitride or nickel chromium resistor material
• Sputtered / plated metal systems
• Sizes from 0.020" x 0.020" to 4.500" x 4.500"
• High volume
• Quick delivery available
APPLICATIONS
Vishay EFI metalized plates can be used as stand-offs,
jumpers or bonding pads in hybrid packages when diced to
small sizes; they are also available with no metallization
(bare ceramic) for use as spacers or insulators. Larger sized
plates can be used where the customer wants to pattern
and etch substrates in-house.
Note
• For any plates smaller than 1.000" x 1.000" or where plate size is not available, metal is only available on one or two surfaces (front or back)
SUBSTRATE MATERIALS
MATERIAL CODE MATERIAL
SURFACE FINISH
(μ" CLA)
APPLICATION
A Alumina (99.6)
A < 3 front / < 4 back as-fired
Cost effective material with wide
range of applications
L < 12 lapped
P< 1 polished
BBeryllium oxide
L 15 to 40 lapped
Highest thermal conductivity
(285 W/mC)
P< 3 polished
N Aluminum nitride
L 10 to 20 lapped
High thermal conductivity
(170 W/mC)
P< 2 polished
PLATE SIZE
X (mils) Y (mils)
20 20
50 50
100 100
200 200
500 500
1000 1000
2000 2000
4500 4500
x
y
SPF1
www.vishay.com
Vishay Electro-Films
Revision: 18-Feb-2021
2
Document Number: 61105
For technical questions, contact: efi@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
RESISTOR MATERIAL
Typical reasons for using NiCr resistor material are for long term stability and high sheet rho. Typical recommended uses for
TaN are for non-hermetic applications where self-passivation is important.
RESISTOR MATERIAL
RESISTOR CODE RESISTOR MATERIAL
SHEET RHO
(Ω/SQ)
± 20 %
TCR
(ppm/°C)
TYPICAL VALUES
ANiCr25± 50
B NiCr 50 ± 100
C NiCr 100 ± 200
D NiCr 200 ± 250
1 TaN 25 ± 50
2 TaN 50 ± 100
3 TaN 75 ± 250
METAL STACK
METAL
CODE
METAL STACK
TYPICAL
APPLICATION
TYPICAL
ATTACHMENT
METHOD
1 TiW (500 Å to 1000 Å) / Au (50 μ" min.) Au and Al wirebondable Epoxy
2 TiW (500 Å to 1000 Å) / Au (100 μ" min.) Au and Al wirebondable Epoxy
3 TiW (500 Å to 1000 Å) / Au (15 μ" to 40 μ") / Ni (20 μ" to 80 μ") / Au (50 μ" min.)
Au and Al wirebondable
and solderable
Epoxy or solder
4 TiW (500 Å to 1000 Å) / Au (15 μ" to 40 μ") / Ni (20 μ" to 80 μ") / Au (100 μ" min.)
Au and Al wirebondable
and solderable
Epoxy or solder
5 TiW (500 Å to 1000 Å) / Pd (1500 Å to 2500 Å) / Au (50 μ" min.)
Au and Al wirebondable
and solderable
Epoxy or solder
6 TiW (500 Å to 1000 Å) / Pd (1500 Å to 2500 Å) / Au (100 μ" min.)
Au and Al wirebondable
and solderable
Epoxy or solder
7 Cr (500 Å to 1500 Å) / Cu (5000 Å to 7000 Å) / Au (100 μ" min.) Au and Al wirebondable Epoxy
8 Cr (500 Å to 1500 Å) / Cu (500 u" min.) / Ni (20 μ" to 80 μ") / Au (100 μ" min.)
Au and Al wirebondable
and solderable.
High power applications
for low metal resistivity
Epoxy or solder