Application Specification

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114-163004

12 MAR 2019 Rev B

Abstract

This specification covers the requirements for application of MULTIGIG RT 2, RT 2-R, RT 2-S, and RT 3

connectors used to interconnect printed circuit (pc) boards. RT 2, RT 2-R, and RT 2-S connectors are

compliant to the VITA 46 standard for VPX architecture, and RT 3 is defined in the VITA 46.30 standard.

RT 3 is interface compatible with all RT 2 variants, but utilizes different board footprints with smaller

compliant pins and plated thru holes to achieve 25+ Gb/s data rates. The connectors consist of end-to-end

stackable modules, available in vertical receptacles (backplane application) and right-angle plugs

(daughtercard application). Half and full-size connector modules are used within slots of a backplane/plug-

in card application. The VITA 46 standard defines connector requirements and OpenVPX standard slot

configurations are defined in VITA 65.0 and 65.1.

Table of Contents

1. INTRODUCTION .............................................................................................................. 4

1.1. Features .............................................................................................................................. 6

Modules ................................................................................................................................................. 6

Guide Assemblies .................................................................................................................................. 6

1.2. Density Levels .................................................................................................................... 6

2. REFERENCE MATERIAL ................................................................................................ 6

2.1. Revision summary ............................................................................................................. 6

2.2. Drawings ............................................................................................................................ 7

2.3. Specifications .................................................................................................................... 7

3. Requirements ................................................................................................................. 7

3.1. Limitations ......................................................................................................................... 7

3.2. Material ............................................................................................................................... 7

3.3. Storage ............................................................................................................................... 8

Ultraviolet Light ...................................................................................................................................... 8

Shelf Life ................................................................................................................................................ 8

Chemical Exposure ............................................................................................................................... 8

Storage Temperature ............................................................................................................................ 8

3.4. Special Assembly Considerations .................................................................................... 8

System Design ....................................................................................................................................... 8

Soldering Exposure ............................................................................................................................... 8

3.5. Module Configuration ...................................................................................................... 10

3.6. PC Board .......................................................................................................................... 14

Material and Thickness ........................................................................................................................ 14

Tolerance ............................................................................................................................................. 14

Hole Dimensions.................................................................................................................................. 14

Layout .................................................................................................................................................. 15

Backdrill dimensions ............................................................................................................................ 16

3.7. Module and Guide Assembly Placement ....................................................................... 16

Spacing ................................................................................................................................................ 16

Polarization .......................................................................................................................................... 16

MULTIGIG RT 2, RT 2-R, RT 2-S, and RT 3

Signal Connectors

114-163004

Rev B

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Registration .......................................................................................................................................... 16

Additional Daughtercard Retention...................................................................................................... 18

Seating ................................................................................................................................................. 19

Mounting Hardware ............................................................................................................................. 20

3.8. Checking Installed Module .............................................................................................. 21

3.9. Mating and Unmating ...................................................................................................... 21

Keying .................................................................................................................................................. 21

Misalignment ........................................................................................................................................ 22

Sequencing .......................................................................................................................................... 22

Wipe Length ......................................................................................................................................... 23

Mating Dimension ................................................................................................................................ 23

Mating and Unmating Force ................................................................................................................ 24

4. Qualification .................................................................................................................. 24

5. Tooling .......................................................................................................................... 24

5.1. Application Tooling ......................................................................................................... 24

Manual Arbor Frame ............................................................................................................................ 24

Automatic Press................................................................................................................................... 24

5.2. Push Bar (Flat Rock) ........................................................................................................ 24

5.3. PC Board Support ............................................................................................................ 24

5.4. Removal ............................................................................................................................ 25

Guide Hardware................................................................................................................................... 25

Backplane Connector Module ............................................................................................................. 25

Daughtercard Connector Module ........................................................................................................ 25

5.5. Repair ............................................................................................................................... 26

6. Visual Aid ...................................................................................................................... 26