THERM-A-GAP
TM
GEL 75
High Performance Fully Cured Dispensable GEL
Contact Information:
Parker Hannifin Corporation
Chomerics Division
77 Dragon Court
Woburn, MA 01801
phone 781 935 4850
fax 781 933 4318
chomailbox@parker.com
www.parker.com/chomerics
Features and Benefits:
• Thermal conductivity: 7.5 W/m-K
• Easily dispensed
• No secondary curing required
• Low thermal impedance
• Ultra-low compression force
• Reworkable
Typical Applications:
• Telecom base stations
• Power supplies and semiconductors
• Memory and power modules
• Microprocessors
• Central processing units (CPUs)
Packaging and Handling:
Material may be packaged in syringes, cartridges or bulk packaged in pails.
Customer Value
Proposition:
Parker Chomerics THERM-A-GAP GEL 75
is a high performance, one component,
dispensable thermal interface material
with 7.5 W/m-K thermal conductivity
developed to conduct heat from
electronics to a heat sink or enclosure.
The material’s heavy paste-like
consistency enables controlled
dispensing, applied in variable
thicknesses to suit application needs.
THERM-A-GAP GEL 75 requires
low compressive force to deform
under assembly pressure subjecting
components, solder joints and leads to
minimal stresses.
It is formulated to accommodate today’s
high performance electronics and is ideal
for automated dispensing machines,
rework and field repair situations.