Socay High Surge Micro Varistor
Revision April 20, 2021
1 / 4
@SOCAY Electronics Corp., Ltd. 2021
Specifications are subject to change without notice.
Please refer to www.socay.com for current information.
SV1812N260G0B
SOCAY Electronics Corp., Ltd. www.socay.com
RoHS Compliant.
Meet IEC 61000-4-5 standard.
SMD type zinc oxide based ceramic chip.
Insulator overcoat keeps excellent low and stable
leakage current.
Quick response time (<0.5ns).
High transient current capability.
High reliability.
Compact size for EIA 1812.
Protection against high working voltage applications
Related transient over voltage.
Symbol
Minimum
Typical
Maximum
Units
V
RMS
—
—
18
V
V
DC
—
—
26
V
V
V
31
—
38
V
V
C
—
—
62
V
C
P
—
2300
—
pF
I
max
—
—
800
A
Notes:
V
RMS
- Maximum AC operating voltage the varistor can maintain and not exceed 10μA leakage current.
V
DC
- Maximum DC operating voltage the varistor can maintain and not exceed 10μA leakage current.
V
V
- Voltage across the device measure at 1mA DC current.
Equivalent to VB “breakdown voltage”.
V
C
- Maximum peak current across the varistor with 8/20μs waveform and 5A pulse current.
Cp - Device capacitance measured with zero volt bias 1Vrms at 1KHZ .
I
max
- Maximum peak current which may be applied with 8/20μs waveform without device failure.
Features
Electrical Characteristics (25±5℃)
Applications
Equivalent Circuits
Socay High Surge Micro Varistor
Revision April 20, 2021
2 / 4
@SOCAY Electronics Corp., Ltd. 2021
Specifications are subject to change without notice.
Please refer to www.socay.com for current information.
SV1812N260G0B
SOCAY Electronics Corp., Ltd. www.socay.com
Size EIA
(EIAJ)
1812
(4532)
Symbol
Millimeters
L
4.50±0.40
W
3.20±0.30
T
2.5 Max
C
0.60±0.30
Solder cream in reflow soldering
Refer to the recommendable land pattern as printing
mask pattern for solder cream.
(1) Print solder in a thickness of 150 to 200μm
Precaution for handling of substrate
Do not exceed to bend the board after soldering thes product
extremely. (reference examples)
Mounting place must be as far as possible from the
position, which is close to the break line of board or on the
line of large holes of board.
Do not bend extremely the board, in mounting another
component. If necessary, use back-up pin (support pin) to
prevent from bending extremely.
Do not break the board by hand. We recommend to use
the machine or the jig to break it.
Size EIA (EIAJ)
1812
(4532)
Symbol
Millimeters
A
1.5
B
3.6
D
3.0
E
6.0
Construction & Dimensions
L
T
C
C
W
Pad Layouts & Precaution for handling of substrate