RA4M2 Group
Renesas Microcontrollers
Leading-performance 100 MHz Arm Cortex-M33 core, up to 512 KB code flash memory with background operation, 8 KB
Data flash memory
, and 128 KB SRAM with Parity/ECC. High-integration with USB 2.0 Full-Speed, SDHI, Quad SPI, and
advanced analog. Integrated Secure Crypto Engine with cryptography accelerators, key management support, tamper
detection and power analysis resistance in concert with Arm TrustZone for integrated secure element functionality.
Features
R01DS0367EJ0110
Rev
.1.10
Jan 27, 2021
■
Arm
®
Cortex
®
-M33 Core
● Armv8-M architecture with the main extension
● Maximum operating frequency:
100 MHz
● Arm Memory Protection Unit (Arm MPU)
– Protected Memory System Architecture (PMSAv8)
– Secure MPU (MPU_S): 8 regions
– Non-secure MPU (MPU_NS): 8 regions
● SysTick timer
– Embeds two Systick timers: Secure and Non-secure instance
– Driven by LOCO or system clock
● CoreSight
™
ETM-M33
■ Memory
● Up to 512-KB code flash memory
● 8-KB data flash memory (100,000 program/erase (P/E) cycles)
●
128-KB SRAM
■ Connectivity
● Serial Communications Interface (SCI) × 6
– Asynchronous interfaces
– 8-bit clock synchronous interface
– Smart card interface
– Simple IIC
– Simple SPI
–
Manchester coding (SCI3, SCI4)
● I
2
C bus interface (IIC) × 2
●
Serial Peripheral Interface (SPI)
● Quad Serial Peripheral Interface (QSPI)
● USB 2.0 Full-Speed Module (USBFS)
● Control Area Network module (CAN)
● SD/MMC Host Interface (SDHI)
● Serial Sound Interface Enhanced (SSIE)
■ Analog
● 12-bit A/D Converter (ADC12)
●
12-bit D/A Converter (DAC12) × 2
● Temperature Sensor (TSN)
■ Timers
● General PWM Timer 32-bit (GPT32) × 4
● General PWM Timer 16-bit (GPT16) × 4
● Low Power Asynchronous General Purpose Timer (AGT) × 6
■ Security and Encryption
● Secure Crypto Engine 9
– Symmetric algorithms: AES
–
Asymmetric algorithms: RSA, ECC, and DSA
– Hash-value generation: SHA224, SHA256, GHASH
– 128-bit unique ID
● Arm
®
TrustZone
®
– Up to three regions for the code flash
– Up to two regions for the data flash
– Up to three regions for the SRAM
– Individual secure or non-secure security attribution for each
peripheral
● Device lifecyle management
●
Pin function
– Up to three tamper pins
– Secure pin multiplexing
■ System and Power Management
● Low power modes
● Battery backup function (VBATT)
● Realtime Clock (RTC) with calendar and VBATT support
● Event Link Controller (ELC)
●
Data Transfer Controller (DTC)
● DMA Controller (DMAC) × 8
● Power-on reset
● Low Voltage Detection (LVD) with voltage settings
● Watchdog Timer (WDT)
● Independent W
atchdog Timer (IWDT)
■ Human Machine Interface (HMI)
● Capacitive Touch Sensing Unit (CTSU)
■ Multiple Clock Sources
● Main clock oscillator (MOSC) (8 to 24 MHz)
● Sub-clock oscillator (SOSC) (32.768 kHz)
● High-speed on-chip oscillator (HOCO) (16/18/20 MHz)
● Middle-speed on-chip oscillator (MOCO) (8 MHz)
● Low-speed on-chip oscillator (LOCO) (32.768 kHz)
● IWDT-dedicated on-chip oscillator (15 kHz)
● Clock trim function for HOCO/MOCO/LOCO
● PLL/PLL2
●
Clock out support
■ General-Purpose I/O Ports
● 5-V tolerance, open drain, input pull-up, switchable driving ability
■ Operating Voltage
● VCC: 2.7 to 3.6 V
■ Operating Temperature and Packages
● Ta = -40℃ to +105℃
– 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch)
– 64-pin LQFP (10 mm × 10 mm, 0.5 mm pitch)
– 48-pin LQFP (7 mm × 7 mm, 0.5 mm pitch)
–
48-pin QFN (7 mm × 7 mm, 0.5 mm pitch)
R01DS0367EJ0110 Rev.1.10
Jan 27, 2021
Page 1 of 92
Datasheet