HEAT SINK BASICS
The heat sink is one of the most fundamental components in cooling electronic devices. For any heat source that cannot
be properly cooled through its own conduction cooling and needs more efficient cooling than a heat spreader, a heat
sink is necessary to move heat away from the source and dissipated through more optimized conduction or convection.
Heat sinks are primarily constructed with a base and fins. The
base is typically a planar surface that makes contact with the
heat source and spreads the heat from the hot spot to the fins.
Fins can be cut or constructed in any number of geometries
which often run perpendicular to the base to disperse heat. The
goal is to optimize the surface area of the heat sink so that the
most heat can be transferred and dissipated.
With rare exceptions, heat sinks are made of a thermally
conductive metal, the most common being Aluminum.
Aluminum has a thermal conductivity of 235 watts per Kelvin
per meter and is lightweight and inexpensive, making it ideal for
lighter, more cost-efficient heat sinks. Copper is also a popular
choice. Although copper is more expensive and heavier, it can
be necessary for high performing applications due to its high
thermal conductivity at 400 W/mK.
Finally, engineers often class heat sinks into “natural”
convection or “forced” convection. Natural convection (Passive)
heat sinks maximize surface area and conduct heat without the
addition of active components. Forced Convection (Active) heat
sinks are designed to utilize components such as fans and
blowers to force cooler air across the fins, creating turbulence
and increasing the cooling performance of the heat sink.