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Modules
Embedded system-on-module based on the NXP i.MX 8M Nano processor; designed
for longevity and scalability in industrial IoT applications
Digi ConnectCore® 8M Nano, based on the NXP® i.MX 8M Nano
application processor, is an integrated system-on-module (SOM)
platform. The Nano is designed for a wide range of industrial,
medical, agricultural and transportation applications, including
Internet of Things (IoT), human-machine interface (HMI),
equipment monitoring, audio/voice, edge computing and
machine learning (e.g. anomaly detection).
Digi ConnectCore 8M Nano features up to 4x power-eicient
Arm® Cortex®-A53 cores and 1x Cortex-M7 core, which allow
it to minimize power consumption while maintaining a high
standard of performance. This SOM is designed for industrial
reliability and the 10+ year product lifecycles of embedded
devices. It helps OEMs lower their R&D and development costs
and realize a lower total cost of ownership by leveraging pre-
certified wireless connectivity, remote management, cloud
integration and a complete Linux soware platform based on
Yocto Project®. In addition, built in Digi TrustFence® enables
OEM developers to integrate critical security and data privacy
capabilities into their products.
DIGI CONNECTCORE M NANO
SECURE, CONNECTED
SYSTEM-ON-MODULE
256kb TCM
CORE COMPLEX 2
Cortex-M7
32 KB I-cache 32 KB D-cache
MULTIMEDIA
3D GPU: 2-shader,
OpenGL ES 3.1,
OpenCL 1.2 Vulkan
ASRC
4-lane MIPI-CSI Interface
4-lane MIPI-DSI Interface
CONNECTIVITY
1 Gb Ethernet
(IEEE 1588, EE & AVB)
S/PDIF TX & RX
5 x I2S/SAI
1 x USB 2.0 OTG & PHY
3 x SPI
4 x I2C
4 x UART
PDM
EXTERNAL MEMORY
3 x eMMC 5.1/SD 3.0
16 x LPDDR4
NAND CTL (BCH62)
Dual-ch. QuadSPI
SECURITY
DRM Ciphers
Secure Clock
Arm® TrustZon
eFuse Key Storage
Random Number
32kb Secure RAM
SYSTEM CONTROL
XTAL
PLLs
Smart DMA x 3
Watchdog x 3
PVM x 4
Timer x 6
Secure JTAG
Temperature Sensor
512kb OCRAM
Digi Microcontroller Assist
Secure Element
PMIC
eMMC LPDDR4 802.11ac 1x1 Bluetooth 5
CORE COMPLEX 1
512 KB L2 cache
Quad Cortex®-A53
Arm Neon™ FPU
32 KB I-cache 32 KB D-cache
BENEFITS
Industrial i.MX 8M Nano quad/dual-core System-on-Module
Digi SMTplus® form factor (40 mm x 45 mm) for ultimate reliability
and design freedom
Power management with both hardware and soware support
for low-power designs
Multi-display and camera capabilities with hardware acceleration
Pre-certified dual-band 802.11a/b/g/n/ac 1x1 and
Bluetooth® 5 connectivity
Seamless cellular modem and Digi XBee® integration
Cloud and edge-compute services integration
Built-in device security, identity and privacy with Digi TrustFence®
Remote monitoring and management with Digi Remote Manager®
Yocto Project Linux support
PRELIMINARY DATASHEET
SPECIFICATIONS
DIGI.COM
Digi ConnectCore® 8M Nano
APPLICATION PROCESSOR
NXP i.MX8 Nano
• 4x Cortex-A53 cores @ 1.4 GHz
• 1x Cortex-M7 core @ 750 MHz core for real-time processing
MEMORY
Up to 8 GB eMMC, up to 1 GB of LPDDR4 (16-bit)
PMIC
Rohm BD71850MWV
GRAPHICS
Graphic Processing Unit:
• GC7000UL with OpenCL and Vulkan support
• 2 shader
• 123 million triangles / sec
• 0.8 giga pixel / sec
• 12.8 GFLOPs 32-bit / 12.8 GFLOPs 16-bit
• Supports OpenGL ES 1.1, 2.0, 3.0, OpenCL
• Shader clock frequency of 500 MHz
LCDIF display controller, supporting up to 1080p 60fps display through MIPI DSI
4-lane MIPI DSI interface
SECURITY
Digi TrustFence®, TRNG, TrustZone, Secure RTC, Secure JTAG, Secure Element
PERIPHERALS/ INTERFACES
1x USB 2.0 OTG controllers with integrated PHY interfaces
3x Ultra Secure Digital Host Controller (uSDHC) interfaces
1x Gigabit Ethernet controller
4x Universal Asynchronous Receiver / Transmitter (UART) modules
4x I2C modules
3x SPI modules
ETHERNET
1x 10/100/1000M Ethernet + AVB
WI-FI
1x1 802.11a/b/g/n/ac dual-band wireless
BLUETOOTH
Bluetooth® 5
ON-MODULE MICROCONTROLLER
ASSIST
Digi Microcontroller Assist™
• Independent Cortex-M0+ microcontroller subsystem
• Supporting ultra-low power modes @ <3µA
OPERATING TEMPERATURE
Industrial: -40° C to 85° C (-40° F to 185° F), depending on use case and enclosure/system design
STORAGE TEMPERATURE
-50° C to 125° C (-58° F to 257° F)
RELATIVE HUMIDITY
5% to 90% (non-condensing)
RADIO APPROVALS
US, Canada, EU, Japan, Australia/New Zealand
EMISSIONS/ IMMUNITY/ SAFETY
FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES- 003 Class B, VCCI Class II, AS 3548,
FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17,
EN 55024, EN 301 489-3
DESIGN VERIFICATION
Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78
Vibration/Shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT
MECHANICAL DIMENSIONS
118 castellated vias, LGA-474, 1.27 mm pitch, fully shielded for radio emissions and thermal management (heat-spreading)
40 mm x 45 mm x 3.5 mm (1.6 in x 1.8 in x 0.1 in)
PRODUCT WARRANTY
3-year