Proprietary Information of
Marlow Industries, Inc.
TEC CUSTOMER VISUAL INSPECTION CRITERIA
Cage No.: 55686
Document Number: 130-0670
Revision: B Page: 1 of 6
Revision History
Rev. ECO No. Description of Change Date Approved By
A Task 6266 Origination 08-06-13 T. McGregor
B 51167 Define solder bump and blister 09-02-16 J. Botens
THIS PROCEDURE MUST BE USED IN COLOR
Proprietary Information of
Marlow Industries, Inc.
TEC CUSTOMER VISUAL INSPECTION CRITERIA
Cage No.: 55686
Document Number: 130-0670
Revision: B Page: 2 of 6
1.0 PURPOSE
1.1 To provide condensed visual inspection requirements of Thermoelectric Coolers (TECs).
The condensed visual inspection criterion is to be used with standard, catalog, and custom products.
2.0 APPLICATION
2. 1 A microscope adjusted to a maximum of 15X shall be required for this inspection. Gold surfaces to be viewed
using the unaided eye.
3.0 DEFINITIONS
3.1 TEC - Thermoelectric Cooler
3.2 TE Material - Thermoelectric material used to produce elements.
3.3 Element - TE column or pellet between ceramics.
3.4 Metallized Ceramic - Substrate that has been processed with a plated metal conductive pattern.
3.5 Scratch - A surface condition caused by an abrasion of one surface to another exposing base metal.
3.6 Base Metal - The base metal of a component, but not including protective finish and solderable coatings.
3.7 Solder - A fusible metallic alloy used to join metal surfaces at a temperature below the melting temperature of
the metals being joined.
3.8 Solder Joint - The connection of similar or dissimilar metals by applying molten solder with no fusion of the
base metal.
3.9 Cold Solder - The solder has a stacked up or piled up, dull appearance and shows signs of improper flow or
wetting action.
3.10 Disturbed Solder - The solder joint may under magnification reveal cracks or fractures. Movement of the
parts during the critical plastic phase, just before solidification, will cause this type of defect.
3.11 Bumps - less than 25 microns (0.001”) in height and covering less than 1% of the surface area are
acceptable.
3.12 Blisters - on pad metallization covering up to 1% of the pad surface area and less than 25 microns (.001”) in
height are acceptable. Blisters on full face patterns greater than 0.005” [0.127 mm] in diameter and covering
more than 10% of the surface area are unacceptable. Blisters on Full-face pattern must not exceed 25 microns
(.001”) in height.