BLOCK DIAGRAM
KEY APPLICATIONS
ConnectCore®
6 SBC
ConnectCard®
for i.MX28
Digi XBee®
ZigBee
ConnectCore®
i.MX53/
Wi-i.MX53
ConnectCore® 6
LCD Kit
NXP i.MX6 based surface-mount module solution with scalable, single-/multi-core
performance and integrated wireless
The ConnectCore
®
6 is an ultra-compact and highly integrated
system-on-module solution based on the NXP i.MX6 Cortex-A9
processor family.
With processor speeds up to 1.2 GHz and fully pin-compatible
single-/dual-/quad-core variants, the ConnectCore 6 oers a
truly future-proof platform solution with scalable performance
and pre-certified wireless 802.11 a/b/g/n and Bluetooth 4.0,
including Bluetooth Low Energy, connectivity.
Its low-profile, surface-mount design maximizes integration
flexibility and significantly reduces design risk in a highly
cost-eective, reliable form factor with optimized heat
dissipation capabilities even in the most demanding quad-
core system configurations.
The ConnectCore 6 comes with a complete Board Support
Package (BSP) for both Linux and Android platforms
supporting secure remote management and web services
through Digi Remote Manager
®
.
DIGI CONNECTCORE 
SCALABLE HIGH-
PERFORMANCE
SYSTEM-ON-MODULE
3D 2D Vector Graphics
Hardware Graphics Accelerators
1080p30 Enc/Dec
Video Codes
ASRC
Audio
Quad ARM® Cortex™-A9 Core
32 KB I-Cache
per Core
32 KB D-Cache
per Core
NEON per Core PTM per Core
Imaging Processing Unit
1 MB L2-Cache + VFPv3
Resizing and Blending
Inversion/Rotation
Image Enhancement
Imaging Processing Unit
HDMI and PHY
MIPI DSI
MIPI CSI2
24-bit RGB, LVDS (x2)
20-bit CSI
Display and Camera Interface
MULTIMEDIA
Up to 64 GB
eMMC Flash
Up to
4 GB DDR3
(64-bit)
Dialog
DA9063
PMIC
802.11
a/b/g/n
Bluetooth
4.0
Kinetis
KL2/K20
MMC 4.4/SD 3.0 x3
MMC 4.4/SDXC
UART x5, 5 Mbps
I
2
C x3, SPI x5
S-ATA and PHY 3 Gbps
USB2 HSIC Host x2
S/PDIF Tx/Rx
PCIe 2.0 (1-Lane)
FlexCAN x2
MLB150 + DTCP
NAND Cntrl. (BCH40)
USB2 OTG and PHY
USB2 Host and PHY
ESAI, I
2
S/SSI x3
PLL, Osc.
Secure JTAG
Clock and Reset
IOMUX
Smart DMA
PWM x4
Timer x3
Power Supplies
Temperature
Monitor
RAMROM
Ciphers
Watch Dog x2
TrustZone
RNG
eFuses
Secure RTC
Security Cntrl
INTERNAL
MEMORY
1 Gb Ethernet +
IEEE® 1588
LP-DDR2, DDR3/
LV-DDR3 x32/64,
533 MHz
CONNECTIVITY
SYSTEM CONTROL
SECURITY
POWER
MANAGEMENT
3.3V GPIO
Keypad
MIPI HSI
BENEFITS
– Scalable Cortex-A9 multi-core performance
– Independent Cortex-M0+/Cortex-M4 Microcontroller
Assist™ subsystem
– Cost-eective, reliable, low-profile surface-mount
module form factor
– Pre-certified 802.11a/b/g/n and Bluetooth 4.0
– Smart Power Management Architecture with PMIC
– Android, Yocto Project Linux and Windows Embedded
Compact soware platform support
– Reliable design with IEC 60068 and HALT verification
– Designed for long-term availability
SPECIFICATIONS
DIGI.COM
Digi ConnectCore® 6
FEATURES
APPLICATION PROCESSOR
NXP i.MX6Solo/DualLite/Dual/Quad with up to four Cortex-A9 cores; Industrial (800/850 MHz),
Commercial (1/1.2 GHz) i.MX6 variants; 32 KB I-Cache/32 KB D-Cache, up to 1 MB L2-Cache
MEMORY
Up to 64 GB eMMC flash, up to 2 GB DDR3 (64-bit)
PMIC
Dialog DA9063
GRAPHICS
Multi-stream-capable HD video engine with 1080p60 decode, 1080p30 encode and 3D video playback in HD in high-performance
families; Superior 3D graphics performance with up to 4 shaders at 200 Mt/s w/OpenCL support; Separate 2D and/or Vertex
acceleration engines for UI support; Stereoscopic image sensor support for 3D imaging
SECURITY
RNG, TrustZone, Ciphers, Security Cntrl, Secure RTC, Secure JTAG, eFuses (OTP)
PERIPHERALS/INTERFACES
MMC 4.4/SD 3.0 x3MMC 4.4/SDXC,
UART x5 (5 Mbps), MIPI HSI, S/PDIF Tx/Rx, I2C x3, SPI x5,
ESAI, I2S/SSI x3, FlexCAN x2, MLB150 + DTCP, S-ATA and PHY (3 Gbps),
USB2 OTG and PHY, USB 2.0 Host and PHY, USB 2.0 HSIC Host x2,
PWM, 3.3V GPIO, Keypad, PCIe 2.0 (x1 lane),
HDMI and PHY, MIPI DSI, MIPI CSI2, 20-bit CSI, 24-bit RGB, LVDS (x2),
RTC, External address/data bus, Watchdog, Timers, JTAG
EXTERNAL BUS
26-bit address / up to 32-bit data (multiplexed and non-multiplexed modes)
ETHERNET
1 Gbit Ethernet + IEEE 1588 (MII10, MII100, RMII, RGMII)
WI-FI
802.11 a/b/g/n: 2.412 - 2.484 GHz, 4.900 - 5.850 GHz
802.11 b: 1, 2, 5.5, 11 Mbps (17 dBm typical ±2 dBm)
802.11 a/g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps (15 dBm typical ±2 dBm)
802.11 n: 15, 30, 45, 60, 90, 120, 135, 150 Mbps (12 dBm typical ±2 dBm)
HT40, MCS 0-7
Security: WEP, WPA-PSK/WPA2-Personal, WPA/WPA2 Enterprise, 802.11i, Access Point Mode (up to 10 clients), Wi-Fi Direct
Industry certifications: Wi-Fi Alliance Logo Certification Ready, CCXv4 ASD Ready”
BLUETOOTH
Profiles: GAP, SPP, FTP, PAN, OPP, HID, A2DP, AVRCP, HDP
ON-MODULE MICROCONTROLLER
ASSIST
Kinetis L: MKL14Z32VFT4, MKL14Z64VFT4, MKL15Z128VFT4, MKL15Z32VFT4, MKL15Z64VFT4, MKL24Z32VFT4, MKL24Z64VFT4,
MKL25Z128VFT4, MKL25Z32VFT4, MKL25Z64VFT4, MKL26Z128VFT4, MKL26Z64VFT4, MKL26Z32VFT4
Kinetis K: K10P48M50SF0, K20P48M50SF0
Internal interconnect to i.MX6 via SPI, Kinetis interfaces available on module pads
OPERATING TEMPERATURE
Industrial: -40° C to 85° C / Commercial: 0° C to 70 C° (depending on use-case and enclosure/system design)
STORAGE TEMPERATURE
-50° C to 125° C (-58° F to 257° F)
RELATIVE HUMIDITY
Relative Humidity 5% to 90% (non-condensing)
RADIO APPROVALS
US, Canada, EU, Japan, Australia/New Zealand
EMISSIONS / IMMUNITY / SAFETY
FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES-003 Class B, VCCI Class II, AS 3548,
FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17,
EN 55024, EN 301 489-3, Safety UL/UR (or equivalent)
DESIGN VERIFICATION
Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78
Vibration/Shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT
MECHANICAL DIMENSIONS
LGA-400, 2 mm pitch, fully shielded (heat-spreading)
PRODUCT WARRANTY
3 years