REFLOW SOLDERING PROFILE OF Oupiin

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Reflow Soldering Profile

迴流焊接曲線圖

Parameter 參數

Reference 參考

Specification 規格

Ramp-up 升溫區

25°C ~150°C

3°C /S Max

Pre- heatimg 預熱區

150°C ~200°C

60~180sec

Reflow 迴焊區

217°C

60~150sec

Peak Temp(Tp)

260-/+5°C

20~40sec

Time 25°C to Tp

25°C ~ Peak Temp.

8 minutes maximum

Cooling 冷卻區

Peak Temp.~150°C

-6°C /S(Max)

This profile is the minimum requirement for evaluating soldering heat resistance of components. Heat

transfer method used for reflow soldering is hot air convection. The actual air temperatures used to

achieve the specified profile largely dependent on the reflow equipment.

這個曲線圖是評估元件器件焊接抗熱的基本要求。應用在對焊接中的熱傳遞方式是熱氣對流。

達到特定曲線圖地實際溫度主要依賴與迴流焊接設備。

This profile is for reference only, Actual production requirement please refer to the specification.

此曲線圖僅供參考，實際生產條件要求請參考規格書。