Additional Information 2 Revision 6.0
2018-08-29
Recommendations for Board Assembly of Infineon Discrete Packages
without Leads
Table of Contents
Table of Contents
Table of Contents ........................................................................................................................... 2
Acronyms and Abbreviations ........................................................................................................... 3
1 Package Description ...................................................................................................... 4
1.1 SON Package Type .................................................................................................................................. 4
1.2 HSOF Package Type ................................................................................................................................ 5
1.3 Package Features and General Handling Guidelines ............................................................................. 5
2 Printed Circuit Board ..................................................................................................... 8
2.1 Routing .................................................................................................................................................... 8
2.2 Pad Design ............................................................................................................................................... 8
2.3 Pad Design for LTI Features .................................................................................................................... 9
2.4 Via-in-Pad Design .................................................................................................................................. 10
3 PCB Assembly ............................................................................................................... 13
3.1 Solder Paste Stencil .............................................................................................................................. 13
3.2 Solder Paste ........................................................................................................................................... 13
3.3 Component Placement ......................................................................................................................... 14
3.4 Reflow Soldering ................................................................................................................................... 14
4 Cleaning ...................................................................................................................... 16
5 Inspection .................................................................................................................... 17
5.1 Optical Solder Joint Inspection ............................................................................................................ 17
5.2 X-Ray Solder Joint Inspection ............................................................................................................... 18
6 Rework ........................................................................................................................ 20
7 References ................................................................................................................... 21
Revision History ............................................................................................................................ 22