GaN Systems
– 1
GN002 Applic
ation Not
e
Thermal
Design
f
or GaN Sy
st
ems’ T
op
-
side
cooled
GaN
PX
®
-
T pack
aged de
vices
Updated on
April 3, 2018
GaN Systems
– 2
Applica
tion Not
e
Outline
•
The Basic
s
-
Our top side cooled GaN
PX
®-
T packag
e
•
Thermal Des
ign for high
-
pow
er with Ga
N
PX
®-
T pack
age
•
Heatsink Mounting Design Cons
ider
ations
•
Bending
Pressure and Def
ormation
Li
mits