Press Release
Heraeus Electronics and Mozaik Technology Ventures sign global
licensing agreement for photoimageable thick film technologies.
Technology will enable Heraeus to develop a new platform of thick
film pastes for ultrafine features, furthering device performance and
miniaturization.
HANAU, Germany and LONDON, England- November 21, 2017- Heraeus
Electronics, a leading provider of materials solutions for the semiconductor
and electronic packaging industries, today announced a global licensing
agreement with Mozaik Technology Ventures Limited, an industry leader in
super fine thick film technology. Under the terms of the agreement,
Heraeus Electronics will license a broad range of Mozaik’s photoimageable
thick film paste technology.
The partnership with Mozaik will enable Heraeus to enhance its market-
leading solution portfolio for customers who manufacture high-profile
electronics, such as sensors, 5G high frequency communication circuits,
smaller passive electronic components and touch panel displays. With the
continued market trend toward smaller and finer electronics elements,
advanced materials and the process technology to create them become
increasingly critical requirements. The Mozaik photoimageable technology
will be used to create a platform of thick film pastes such as silver, silver-
platinum, silver-palladium, gold, platinum conductors and ceramic/glass
insulators for these specific application areas.
According to Frank Stietz, President of Heraeus Electronics, “We have
seen a market trend in thick film materials toward smaller features, such as
conductors for finer lines and spaces. The industry will need to meet the
demand and requirements for electronic component miniaturization and
higher density microelectronic circuits. Mozaik’s product lines and
technologies will enable us to set new standards in electronics capabilities
and performance for our customers.”
Heraeus Electronics expects that by using photoimageable thick film
pastes, its customers can build electronic components and circuits with
lines and spaces (l/s) below 50 microns in size (demonstrated l/s already at
25 microns). The current state-of-the-art feature size with standard thick
film inks is 75 microns under optimized and highly engineered conditions.
In actual, practical manufacturing settings, most devices are built with 100
to 150 microns on an industrial scale.
Steve Muckett, the founder and Managing Director of Mozaik Technology
Ventures, added, “We are pleased to partner with Heraeus Electronics
because they are a strong and reliable supplier of electronic materials with
a global reach. With Heraeus using our fine line capable pastes, it will drive
benefits and innovation across our industry. We anticipate that many
manufacturers of ceramic based circuits and components will be able to
introduce low-cost and very fine resolution parts, which the market needs.”
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