2Maxim Integrated
MAX44241/MAX44243/MAX44246
36V, Low-Noise, Precision,
Single/Quad/Dual Op Amps
Supply Voltage (V
DD
to GND) .............................-0.3V to +40V
All Other Pins ................................(GND - 0.3V) to (V
DD
+ 0.3V)
Short-Circuit Duration, OUTA,
OUTB to Either Supply Rail………………………… ............. 1s
Continuous Input Current (Any Pin) ..................................20mA
Differential Input Current ................................................. Q20mA
Differential Input Voltage (Note 1) ....................................... .Q6V
Continuous Power Dissipation (T
A
= +70NC)
5-Pin SOT23 (derate 3.9mW/NC above +70NC).......312.6mW
8-Pin FMAX (derate 4.8mW/NC above +70NC) ........387.8mW
8-Pin SO (derate 7.60mW/NC above +70NC)...........606.1mW
14-Pin SO (derate 12.30mW/NC above +70NC).......987.7mW
14-Pin TSSOP (derate 10mW/NC above +70NC) .....796.8mW
Operating Temperature Range ........................ -40NC to +125NC
Junction Temperature ....................................................+150NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering,10s) .................................+300NC
Soldering Temperature (reflow) ......................................+260NC
ABSOLUTE MAXIMUM RATINGS
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Note 1: The amplifier inputs are connected by internal back-to-back clamp diodes. In order to minimize noise in the input stage,
current-limiting resistors are not used. If differential input voltages exceeding ±1V are applied, limit input current to 20mA.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
µMAX
Junction-to-Ambient Thermal Resistance (q
JA
) .....206.3NC/W
Junction-to-Case Thermal Resistance (q
JC
)
..............42NC/W
SO-8
Junction-to-Ambient Thermal Resistance (q
JA
) ........132NC/W
Junction-to-Case Thermal Resistance (q
JC
)
..............38NC/W
SO-14
Junction-to-Ambient Thermal Resistance (q
JA
) ..........81NC/W
Junction-to-Case Thermal Resistance (q
JC
)
..............32NC/W
SOT23
Junction-to-Ambient Thermal Resistance (q
JA
) .....255.9NC/W
Junction-to-Case Thermal Resistance (q
JC
)
..............81NC/W
TSSOP
Junction-to-Ambient Thermal Resistance (q
JA
) .....100.4NC/W
Junction-to-Case Thermal Resistance (q
JC
)
..............30NC/W
PACKAGE THERMAL CHARACTERISTICS (Note 2)
ELECTRICAL CHARACTERISTICS
(V
DD
= 30V, V
GND
= 0V, V
IN+
= V
IN-
= V
DD
/2, R
L
= 5kΩ to V
DD
/2, T
A
= -40°C to +125°C, unless otherwise noted. Typical values at
T
A
= +25°C.) (Note 3)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage Range
V
DD Guaranteed by PSRR 2.7 36
V
Power-Supply Rejection Ratio
(Note 4)
PSRR
V
DD
= 2.7V to 36V, T
A
=
+25NC
148 166
dB
V
DD
= 2.7V to 36V, -40NC < T
A
< +125NC 146
Quiescent Current per
Amplifier
I
DD R
L
= J
T
A
=
+25NC
0.42 0.55
mA
-40NC < T
A
<
+125N
C
0.60
Power-Up Time
t
ON 20 Fs
DC SPECIFICATIONS
Input Common-Mode Range
V
CM Guaranteed by
CMRR
test
(V
GND
- 0.05)
(V
DD
- 1.5)
V
Common-Mode Rejection Ratio
(Note 4)
CMRR V
CM
= (V
GND
- 0.05V) to (V
DD
- 1.5V) 146 166
dB
Input Offset Voltage (Note 4)
V
OS
1 5 F
V