Chomerics
37
Description
Chomerics’ family of thin heat
spreaders provides a low-cost,
effective means of cooling IC
devices in restricted spaces
where conventional heat sinks are
inappropriate.
T-Wing spreaders consist of 5oz.
(0.007inch/0.18mm thick) flexible
copper foil between electrically
insulating films. High strength
silicone PSA (pressure-sensitive
adhesive) provides a strong bond
to the component. The compliant
nature of these “thermal wing” heat
spreaders permits nearly 100%
adhesive contact with non-flat
package surfaces, optimizing
thermal and mechanical
performance.
Features/Benefits
• Component junction
temperature reduction of
10-20°C is common
• Easily added to existing
designs to lower component
temperatures and improve
reliability
• Custom shapes available for
complex designs
Typical Applications
• Microprocessors
• Memory modules
• Laptop PCs and other high
density, handheld portable
electronics
• High speed disk drives
Design Details
• Low profile (0.33mm/0.013in)
allows use in limited space
environments
• Easy peel and stick adhesion to
all surfaces, including packages
with residual silicone mold
release
• Offers low cost cooling for many
package types
• Low application force
(<5psi/ 0.03MPa) minimizes risk
of damage to component
• Available in a range of standard
sizes
• Pliable nature allows
conformance to concave or
otherwise non-flat surfaces for
optimal thermal and mechanical
performance
• Light weight (0.039 oz/inch2)
• Standard parts are scored for
easy forming and alignment
• Easy removal for device
replacement
• Available die-cut on continuous
rolls
Typical Properties Test Method
Physical
Color Black Visual
Total Thicknesses, inches (mm) 0.013 (0.33) ASTM D374
PSA Type Silicone based --
PSA thickness, inches (mm) 0.002 (0.05) Visual
Insulator Type Black polyester --
Insulator Layer Thickness, inches (mm) 0.001 (0.025) --
Weight, oz/inch
2
0.039 --
Themal Conductor Copper --
Maximum Operating Temperature °F (°C) 257 (125) --
Thermal Conductor Thickness, inches (mm) 0.007 (0.178) --
Electrical
Dielectric Strength,
Vac/mil (KVac/mm)
5,000 (200)
for each dielectric layer
ASTM D149
Volume Resistivity, (ohm-cm) N/A ASTM D149
Dielectric Constant @1,000 MHz N/A ASTM D150
Dissipation Factor @ 1,000 kHz N/A Chomerics Test
Regulatory
Flammability Rating
(See UL File E140244)
V-0 UL 94
RoHS Compliant Yes Chomerics Certification
Shelf Life, months from date of manufacture 12 Chomerics
T-WING
®
Heat Spreaders
Thin Heat Spreaders
38
ENGINEERING YOUR SUCCESS.
T-Wing
®
Heat Spreaders
Typical Thermal Properties
(Performed on surface of 196 lead 3 Watt PQFP package)
Standard Part Size inches(mm)
Environment*
Sizes (inches)
Without
T-Wing
0.5x2
(12.7x50.8)
0.5x3
(12.7x76.2)
0.75x3
(19.1x76.2)
1x3
(25.4x76.2)
1x4
(25.4x101.6)
1.5x4
(38.1x101.6)
Restricted
Convection**
Thermal Resistance
Rj-a (°C/W)
26 25 23 23 22 20 19
Case
Temperature (°C)
92 82 78 76 72 70 68
100 LFM***
Thermal Resistance
Rj-a (°C/W)
18 16 14 14 14 13 12
Case
Temperature (°C)
68 57 52 49 46 44 44
* Measured values do not account for heat losses through bottom of case and leads. Ambient temperature range from 21
o
C to 24
o
C
** Restricted convection in a simulated notebook computer environment-a 1x5x6inch (2.54x12.7x15.2cm) plexiglass box
*** T-Wing long axis perpendicular to air flow direction in wind tunnel
Notes
Rj-a = thermal resistance from junction to ambient
LFM = airflow rate (linear feet per minute)
Typical Adhesion Performance
Test Procedure Result Test Method
Lap Shear - Room Temperature apply/60 min. R.T. dwell/R.T. pull 960 oz/in
2
(414 kPa) ASTM D1000
Lap Shear - Elevated Temperature apply/60 min. R.T. dwell/100°C pull 53 oz/in
2
(23 kPa) ASTM D1000
90° Peel - Room Temperature apply/1 min. R.T. dwell/R.T. pull 40 oz/in (441 g/cm) ASTM B571/D2861
90° Peel - Elevated Temperature apply/60 min. R.T. dwell/100°C pull 20 oz/in (220g/cm) ASTM B571/D2861
Creep Adhesion, days 275°F (135°C), 7 oz/in
2
(3 kPa), on aluminum >80 days, no failure P.S.T.C. No. 7
Environmental Stress Thermal Performance
Environment Before After
Heat Aging
Rj-a (°C/W) Restricted Convection 20.3 20.6
Rj-a (°C/W) 100 LFM 12.7 13.1
High Temperature/Humidity
Rj-a (°C/W) Restricted Convection 21.4 21.4
Rj-a (°C/W) 100 LFM 14.1 14
Temperature Cycling
Rj-a (°C/W) Restricted Convection 21.4 21.7
Rj-a (°C/W) 100 LFM 14.1 13.9
Note: Tested with a 1” x 4” (25.4 x 101.6 mm) T-WING
Environmental Stress Adhesive Performance
Environment
90° Peel Strength
oz/in (gm/cm)
Control 36 393
Heat Aging 36 393
High Temperature/Humidity 46 514
Temperature Shock 38 424
Temperature Cycling 30 335
Note: Average of three samples tested per ASTM B571/D2861.