Press information
Page 1 of 4
Contact:
Kyocera Fineceramics GmbH
Daniela Faust
Manager Corporate Communications
Hammfelddamm 6
41460 Neuss
Germany
Tel.: +49 2131/16 37 - 188
Fax: +49 2131/16 37 - 150
Mobil: +49 175/7275706
daniela.faust@kyocera.de
www.kyocera.eu
Grayling Düsseldorf
Jan Leder, Anne Beringer
Rather Str. 49d
40476 Düsseldorf
Germany
Tel.: +49 211/96 485 - 41/ - 48
Fax: +49 211/96 485 - 45
jan.leder@grayling.com
anne.beringer@grayling.com
KYOCERA Concludes Agreement to Acquire
100% of Shares in NEC Toppan Circuit Solutions
Kyoto/Neuss — August 6, 2013 — Kyocera Corporation (NYSE:
KYO)(TOKYO: 6971) today concluded a share transfer
agreement with Toppan Printing Co., Ltd. and NEC Corporation
to acquire all shares of the printed circuit board (PCB)
manufacturing company NEC Toppan Circuit Solutions, Inc.
(herein “TNCSi”) in order to further strengthen and expand the
Kyocera Group’s organic substrate business.
Details of the agreement are listed below.
1. Content:
Share transfer agreement concerning NEC TOPPAN
CIRCUIT SOLUTIONS, INC.
2. Involved
parties:
KYOCERA Corporation; TOPPAN PRINTING CO.,
LTD.; NEC Corporation
3. Date of
agreement:
August 6, 2013
4. Target
company:
Company name: NEC TOPPAN CIRCUIT SOLUTIONS,
INC.
Shareholders: TOPPAN PRINTING CO., LTD. (55%);
NEC Corporation (45%)
Operations: High-density multilayer PCBs for industrial
applications, build-up PCBs for consumer applications,
module PCBs
Press information
Page 2 of 4
Contact:
Kyocera Fineceramics GmbH
Daniela Faust
Manager Corporate Communications
Hammfelddamm 6
41460 Neuss
Germany
Tel.: +49 2131/16 37 - 188
Fax: +49 2131/16 37 - 150
Mobil: +49 175/7275706
daniela.faust@kyocera.de
www.kyocera.eu
Grayling Düsseldorf
Jan Leder, Anne Beringer
Rather Str. 49d
40476 Düsseldorf
Germany
Tel.: +49 211/96 485 - 41/ - 48
Fax: +49 211/96 485 - 45
jan.leder@grayling.com
anne.beringer@grayling.com
5.Transaction
schedule:
October 1, 2013:
- All shares of TNCSi to be transferred to KYOCERA
Corporation
- TNCSi to become wholly owned subsidiary of
KYOCERA Corporation
6. Motive and intent:
The market for PCBs is forecast to continue expanding steadily on
the back of growing demand for telecommunications infrastructure
equipment, and digital consumer electronics — centered on
smartphones and mobile computing tablets.
The Kyocera Group has been expanding its business in the PCB
market focusing on organic packages sold by its wholly owned
subsidiary, Kyocera SLC Technologies (herein “KST”), which boasts
one of the highest shares in the industry for FC-BGAs
*1
used in
high-end ASIC applications. KST also plans to expand its business
territory through the recent full-fledged launch of smaller, lower
profile FC-CSPs
*2
for the high-growth smartphone and mobile
computing tablet sectors.
Alternatively, TNCSi has focused its business in the PCB market on
the motherboard field, by widely expanding its business territory by
developing, manufacturing and selling extremely low profile and
multilayer boards used in products ranging from high-end
telecommunications infrastructure equipment, module PCBs used in
smartphones, and PCBs for in-vehicle applications. By utilizing the
company’s broad range of high-density PCBs and its high level of