CMS16
2018-04-04
1
TOSHIBA Schottky Barrier Diode
CMS16
Switching Mode Power Supply Applications
Portable Equipment Battery Applications
DC-DC Converter Applications
• Repetitive peak reverse voltage : V
RRM
= 40 V
• Average forward current : I
F (AV)
= 3 A
• Peak forward voltage : V
FM
= 0.55 V (max) (@I
FM
= 3 A)
• Suitable for compact assembly due to a small surface-mount package:
“M−FLAT
TM
” (Toshiba package name)”
Absolute Maximum Ratings
(Ta = 25°C)
Characteristic Symbol Rating Unit
Repetitive peak reverse voltage V
RRM
40 V
Average forward current I
F (AV)
3 (Note 1) A
Non-repetitive peak forward surge current I
FSM
30 (50 Hz) A
Junction temperature T
j
−40 to 150 °C
Storage temperature range T
stg
−40 to 150 °C
Note 1: Tℓ = 106°C Device mounted on a ceramic board
Board size : 50 mm × 50 mm
Soldering land size : 2 mm × 2 mm
Board thickness : 0.64 mm
Rectangular waveform (α = 180°), V
R
= 20 V
Note 2 : Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the
reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are
within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics
(Ta
=
25°C)
Characteristic Symbol Test Condition Min Typ. Max Unit
Peak forward voltage
V
FM (1)
I
FM
= 1 A (pulse test) 0.4
V
V
FM (2)
I
FM
= 3 A (pulse test) 0.50 0.55
Peak repetitive reverse current
I
RRM (1)
V
RRM
= 5 V (pulse test) 2
μA
I
RRM (2)
V
RRM
= 40 V (pulse test) 26 200
Junction capacitance C
j
V
R
= 10 V, f = 1 MHz 95 pF
Thermal resistance
(junction to ambient)
R
th (j-a)
Device mounted on a ceramic board
board size : 50 mm × 50 mm
soldering land size : 2 mm × 2 mm
board thickness : 0.64 mm
60
°C/W
Device mounted on a glass-epoxy board
board size : 50 mm × 50 mm
soldering land size : 6 mm × 6 mm
board thickness : 1.6 mm
135
Device mounted on a glass-epoxy board
board size : 50 mm × 50 mm
soldering land size : 2.1 mm × 1.4 mm
board thickness : 1.6 mm
210
Thermal resistance (junction to lead) R
th (j-ℓ)
16 °C/W
Unit
: mm
JEDEC
JEITA
TOSHIBA 3-4E1A
Weight: 0.023 g (typ.)
Start of commercial production
2003-12
CMS16
2018-04-04
2
Marking
Abbreviation Code Part No.
SF CMS16
Land pattern dimens ions for reference only
Handling Preca ution
1) Schottky barrier diodes (SBDs) have reverse current greater than other types of diodes. This makes SBDs more
vulnerable to damage due to thermal runaway under high-temperature and high-voltage conditions. Thus, both
forward and reverse power losses of SBDs should be considered for thermal and safety design.
2) The absolute maximum ratings are rated values that must not be exceeded during operation, even for an instant.
The following are the recommended general derating methods for designing a circuit board using this device.
V
RRM
: Use this rating with reference to 1) above. V
RRM
has a temperature
coefficient of 0.1%/℃ at low temperatures. Take this coefficient into account when designing a
circuit board that will be operated in a low-temperature environment.
I
F(AV)
: We recommend that the worst-case current be no greater than 80% of the absolute maximum
rating of I
F(AV)
and that the worst-case junction temperature, T
j
, be kept below 120℃. When using
this device,
allow margins, referring to the T
a(max)
-I
F(AV)
curve.
I
FSM
: This rating specifies peak non-repetitive forward surge current. This only applies to an abnormal
operation, which seldom occurs during the lifespan of a device.
T
j
: Derate device parameters in proportion to this rating in order to ensure high reliability.
We recommend that the junction temperature (T
j
) of a device be kept below 120℃.
3) Thermal resistance (junction-to-ambient) varies with the mounting conditions of a device on a circuit board. An
appropriate thermal resistance value should be used, considering the heatsink, circuit board design and land
pattern dimensions (provided for reference only).
4) For other design considerations, see the Rectifiers databook or the Toshiba website.
3.0
1.4
Unit: mm
1.4