Reliability Tests Report
1. Thermal tests
Test Item Test Condition
Failure Size
/ Sample Size
Heat resistance
(Reflow)
Peak : 260 deg.C(a moment)
Reflow zone : 230 deg.C 30 to 50 s
Preheat : 180 to 190 deg.C , 60 to 120 s
0 / 32
Heat resistance
(Flow)
4 times
0 / 32
Peak : 260 deg.C
Immersion time : 10 s
Heat resistance
(Iron)
0 / 32
Temperature
cycling
0 / 50
- 55 deg.C(30 min) to 125 deg.C(30 min) ,100 cycles
2. Mechanical tests
Test Item Test Condition
Failure Size
/ Sample Size
Solderability
-
-
-
3. Life tests
Test Item Test Condition
0 / 30
0 / 30
0 / 30
0 / 20
-
DF5A6.8FU
Failure Size
/ Sample Size
Product Name:
Package Name:
USV
Once
Time : 3 s
Once
Temperature of the iron tip : 400 deg.C
Solder bath : Sn-Ag-Cu 245 deg.C , 5 s ,once (using Flux)
Solder bath : Sn-Pb 230 deg.C , 5 s ,once (using Flux)
0 / 11
-
-
-
-
-
-
-
-
-
Steady state
operation
High temp.
storage
High temp. high
humidity storage
Pressure cooker
test
-
-
Ta = 25 deg.C, P = 200mW ,1000 h
Ta = 125 deg.C ,1000 h
Ta = 85 deg.C, RH = 85% ,1000 h
Ta = 121 deg.C(203kPa)(Unsaturated) ,96 h
-
-
-
The information contained in this Reliability Test Report represents the result of our internal reliability tests conducted in accordance with JEITA ED-4701 test standards, and is provided for your reference only.
TOSHIBA DISCLAIMS ANY WARRANTY AND ASSUMES NO LIABILITY FOR CUSTOMERS' DESIGNS AND/OR PRODUCTS DEVELOPED USING SUCH INFORMATION.
For detailed reliability test information, such as test conditions and criteria, please contact your Toshiba sales representative.
Copyright © 2012 TOSHIBA CORPORATION, All Rights Reserved.