Industry’s First Multi-Mode WPC
Compliant Wireless Power Receiver IC
Preliminary Datasheet
IDTP9020
Revision 0.2
1
© 2013 Integrated Device Technology, Inc.
Features
Single-Chip 5W Solution for Wireless Power Consortium
(WPC) “Qi” Compliant Power Receiver
Conforms to WPC Specification Version 1.1
Specifications
Integrated Synchronous Full-Bridge Rectifier
Integrated Synchronous Buck Converter
Embedded MCU, ROM, RAM, & ADC
Integrated USB Adaptor Switch for USB Charging
Closed-Loop Power Transfer Control between Base
Station and Mobile Device
Security and Encryption up to 64 bit
Foreign Object Detection (FOD)
Over-Temperature/Voltage Protection
Compatible with all WPC Receiver Coils Including
Proprietary and PCB-based Coils
Open-Drain LED Indicator Outputs
I
2
C Interface
Applications
WPC-Compliant Wireless Chargers for Mobile
Applications
Mobile and Smart Phones
Tablets, MIDs
Digital Cameras, MP3 Players
Remote Controls
GPS
Description
The IDTP9020 is a highly-integrated single-chip WPC-compliant
wireless power receiver IC. The device receives an AC power
signal from a compatible wireless transmitter and converts it into
a regulated 5V output voltage which can be used to power
devices or supply the charger input in mobile applications. The
IDTP9020 integrates a high-efficiency synchronous full-bridge
rectifier, high-efficiency synchronous buck converter, and control
circuits used to modulate the load to transmit WPC-compliant
message packets to the transmitter station to optimize power
delivery. Power delivery is limited to 5W in accordance with the
Qi specification.
The device includes over-temperature/voltage protection and a
Foreign Object Detection (FOD) method to protect the base
station and mobile device from over-heating in the presence of a
metallic foreign object. Fault conditions associated with power
transfer are managed by the embedded MCU, which also
controls status LEDs to indicate operating and fault modes.
1 u F
I D T P 9 0 2 0
R E C _ O U T
1 1 . 4 u H
1 8 3 n F
2 n F
E N
L D O 2 P 5 V _ I N
1 u F
U S B / A D P _ I N
R E C _ O U T
S C L
S D A
R E S E T
2 2 n F
G P I O _ 0
G P I O _ 1
G P I O _ 2
G P I O _ 3
G P I O _ 4
G P I O _ 5
G P I O _ 6
G P I O _ 6
G P I O _ 5
G P I O _ 4
G P I O _ 3
G P I O _ 2
G P I O _ 1
G P I O _ 0
I N _ P
I N _ P
R E G _ I N
I N _ M
I N _ M
E N
G N D
L D O 2 P 5 V _ I N
U S B _ I N
B U C K 5 V R _ I N
B U C K 5 V R _ I N
S C L
S D A
A G N D
D G N D
R E S E T
A C M _ P
2 2 n F
A C M _ M
3 3 0 n F
Z R E F _ M
3 3 0 n F
Z R E F _ P
R E F G N D
1 0 u F
R E C _ O U T
4 0 u F
1 u F
L D O 5 V
1 u F
L D O 2 P 5 V
4 . 7 u F
1 0 u F
B U C K 5 V R
4 7 n F
4 7 n F
R E C _ O U T
R E C _ O U T
P G N D
L X
L X
L D O 5 V
L D O 2 P 5 V
B U C K 5 V R _ S N S
U S B _ O U T
I S N S
B S T
R E C _ O U T
L X
B U C K 5 V R B U C K 5 V R
I N _ P
I N _ M
B U C K 5 V R _ I N
L D O 5 V
L D O 5 V
1 0 K
1 0 0
1 0 0 K
2 . 7 K 2 . 7 K
1 0 0 n F
5 K
5 K
5 K
5 K
5 K
5 K
Packages: 7mm x 7mm QFN56 (See page 28) and 4.86mm x 4.65mm WLCSP-99 (See page 29)
Ordering information (See page 30)
Mobile Device
Receiver
Output Load
Control System
Power Pick-Up
Comm Cont
Mod
Sensing
Control
Out
PWR
Base Station
Transmitter(s)
Input Power
Control System
Power Generation
Comm
Cont
DeMod
IN
PWR
Sensing
Control
Induction
Load
Reflection
Comm
Control
Wireless
Interface
IDTP9020
Preliminary Datasheet
Revision 0.2
2
© 2013 Integrated Device Technology, Inc.
ABSOLUTE MAXIMUM RATINGS
These absolute maximum ratings are stress ratings only. Stresses greater than those listed below (Table 1 and Table 2) may cause permanent damage
to the device. Functional operation of the IDTP9020 at absolute maximum ratings is not implied. Application of the absolute maximum rating conditions
affects device reliability.
Table 1. Absolute Maximum Ratings Summary. All voltages are referred to ground, unless otherwise noted.
MAXIMUM
RATING
UNITS
-1 to 24
V
-0.3 to 24
V
-0.3 to
BUCK5VR_IN+5
V
-0.3 to 2.75
V
-0.3 to +0.3
V
-0.3 to 6.0
V
1.5
A
1
A
RMS
2
A
Table 2. Package Thermal Information
SYMBOL
DESCRIPTION
MAXIMUM
RATING
NTG56-TQFN
MAXIMUM
RATING
WLCSP-99
37 THERMAL VIAS
MAXIMUM
RATING
WLCSP-99
0 THERMAL VIAS
UNITS
Θ
JA
Thermal Resistance Junction to Ambient
28.5
33.4
52.7
C/W
Θ
JC
Thermal Resistance Junction to Case
11.2
0.28
0.28
C/W
Θ
JB
2
Thermal Resistance Junction to Board
0.56
C/W
T
J
Junction Temperature
0 to +150
0 to +150
0 to +150
C
T
A
Ambient Operating Temperature
0 to +85
0 to +85
0 to +85
C
T
STG
Storage Temperature
-55 to +150
-55 to +150
-55 to +150
C
T
LEAD
Lead Temperature (soldering, 10s)
+300
+300
+300
C
Note 1: The maximum power dissipation is P
D(MAX)
= (T
J(MAX)
- T
A
) / θ
JA
where T
J(MAX)
is 125°C. Exceeding the maximum allowable power dissipation will result in excessive die
temperature, and the device will enter thermal shutdown.
Note 2: This thermal rating was calculated on a JEDEC 51 standard 4-layer board with dimensions 3” x 4.5” in still air conditions. Actual thermal resistance is affected by
PCB size, solder joint quality, layer count, copper thickness, air flow, altitude, and other unlisted variables. For the NTG56 package, connecting the 5.7mm X 5.7mm EP to
internal/external ground planes with a 5x5 matrix of PCB plated-through-hole (PTH) vias, from top to bottom sides of the PCB, is recommended for improving the overall
thermal performance.