Skylab M&C Technology Co., Ltd

802.11b/g/n IoT WLAN Module Datasheet

Model WG219

2 / 19

WG219-DA-001,A/2

Contents

General Description ...................................................................................................................... 4

2. Applications .................................................................................................................................. 4

3. Features ....................................................................................................................................... 4

4. Application Block Diagram ........................................................................................................... 5

5. Module Pinout and Pin Description .............................................................................................. 6

Module Pinout ........................................................................................................................... 6

Pin Description .......................................................................................................................... 7

Strapping Pins .......................................................................................................................... 8

6. Interfaces ..................................................................................................................................... 8

GPIO ......................................................................................................................................... 8

I2C ............................................................................................................................................ 8

I2S ............................................................................................................................................ 9

UART ........................................................................................................................................ 9

SDIO ......................................................................................................................................... 9

SPI(Master/Slave) ................................................................................................................... 10

SPI(Slave) ............................................................................................................................... 10

HSPI(Slave) ............................................................................................................................ 10

PWM ....................................................................................................................................... 11

IR Remote ............................................................................................................................... 11

7. PCB Footprint and Dimensions .................................................................................................. 11

8. Electrical Characteristics ............................................................................................................ 12

9. Performance Specification ......................................................................................................... 13