EPC – THE LEADER IN GaN TECHNOLOGY | WWW.EPC-CO.COM
EPC Wafer Sales
EPC is pleased to oer our development partners the option
of procuring EPC enhancement-mode gallium nitride (GaN)
devices in wafer form for ease of integration. A variety of
additional available services is detailed below. If you have
specic requirements not addressed below, please contact
us at info@epc-co.com
EFFICIENT POWER CONVERSION
For information on pricing and availability please contact
your local sales representative or EPC @ info@epc-co.com
Wafer Sales and Services
• Bumped wafers
• Wafers without solder bumps
- Under Bump Metal (UBM): 10 µm PI + 2
KA Ti sputter + 4 Ka Cu sputter + 8 µm
Cu plating)
• Extra services available per wafer
- Wafer thinning down to 260 µm
- Metallization of the wafer backside
- Ti/Ni/Au
- Ti/Ni/Ag
- Backside coating tape