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© MOTOROLA INC., 1996
MOTOROLA
SEMICONDUCTOR
TECHNICAL DATA
MC68CK338
Technical Summar y
32-Bit Modular Microcontroller
1 Introduction
The MC68CK338, a highly-integrated 32-bit microcontroller, combines high-performance data manipu-
lation capabilities with powerful peripheral subsystems. The MCU is built up from standard modules that
interface through a common intermodule bus (IMB). Standardization facilitates rapid development of
devices tailored for specific applications.
The MCU incorporates a low-power 32-bit CPU (CPU32L), a low-power system integration module
(SIML), a queued serial module (QSM), and a configurable timer module 6 (CTM6).
The MCU clock can either be synthesized from an external reference or input directly. Operation with a
32.768 kHz reference frequency is standard. The maximum system clock speed is 14.4 MHz. System
hardware and software allow changes in clock rate during operation. Because MCU operation is fully
static, register and memory contents are not affected by clock rate changes.
High-density complementary metal-oxide semiconductor (HCMOS) architecture and 3V nominal oper-
ation make the basic power consumption of the MCU low. Power consumption can be minimized by
either stopping the system clock, or alternatively, stopping the system clock only at the CPU32L, and
allowing the other modules to continue operation. The CPU32 instruction set includes a low-power stop
(LPSTOP) command that allows either of these power saving modes.
The CTM6 includes new features such as a port I/O submodule, a 64-byte RAM submodule and a real
time clock submodule.
Refer to the Motorola Microcontroller Technologies Group Web page at http://www.mcu.sps.mot.com
for the most current listing of device errata and customer information.
Table 1 Ordering Information
Package Type Frequency
(MHz)
Voltage Temperature Package
Order
Quantity
Order Number
144–Pin TQFP 14.4 MHz 2.7V to 3.6V – 40 to + 85
°
C 2 pc tray
60 pc tray
300 pc tray
SPMC68CK338CPV14
MC68CK338CPV14
MC68CK338CPV14B1
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Section Page
MOTOROLA MC68CK338
2 MC68CK338TS/D
1 Introduction
1
1.1 Features ......................................................................................................................................3
1.2 Block Diagram .............................................................................................................................4
1.3 Pin Assignments ..........................................................................................................................5
1.4 Address Map ...............................................................................................................................6
1.5 Intermodule Bus ..........................................................................................................................6
2 Signal Descriptions
7
2.1 Pin Characteristics ......................................................................................................................7
2.2 MCU Power Connections ............................................................................................................8
2.3 MCU Driver Types .......................................................................................................................8
2.4 Signal Characteristics ..................................................................................................................9
2.5 Signal Function ..........................................................................................................................10
3 Low-Power System Integration Module
12
3.1 Overview ...................................................................................................................................12
3.2 System Configuration Block ......................................................................................................14
3.3 System Clock ............................................................................................................................16
3.4 System Protection Block ...........................................................................................................22
3.5 External Bus Interface ...............................................................................................................26
3.6 Chip-Selects ..............................................................................................................................30
3.7 General-Purpose Input/Output ..................................................................................................38
3.8 Resets .......................................................................................................................................41
3.9 Interrupts ...................................................................................................................................44
3.10 Factory Test Block .....................................................................................................................47
4 Low-Power Central Processor Unit
48
4.1 Overview ...................................................................................................................................48
4.2 Programming Model ..................................................................................................................48
4.3 Status Register ..........................................................................................................................50
4.4 Data Types ................................................................................................................................51
4.5 Addressing Modes .....................................................................................................................51
4.6 Instruction Set Summary ...........................................................................................................51
4.7 Background Debugging Mode ...................................................................................................56
5 Queued Serial Module
57
5.1 Overview ...................................................................................................................................57
5.2 Address Map .............................................................................................................................58
5.3 Pin Function ..............................................................................................................................59
5.4 QSM Registers ..........................................................................................................................59
5.5 QSPI Submodule .......................................................................................................................64
5.6 SCI Submodule .........................................................................................................................72
6 Configurable Timer Module 6
78
6.1 Overview ...................................................................................................................................78
6.2 Address Map .............................................................................................................................80
6.3 Time Base Bus System .............................................................................................................82
6.4 Bus Interface Unit Submodule (BIUSM) ....................................................................................84
6.5 Counter Prescaler Submodule (CPSM) ....................................................................................85
6.6 Clock Sources for Counter Submodules ...................................................................................87
6.7 Free-Running Counter Submodule (FCSM) ..............................................................................87
6.8 Modulus Counter Submodule (MCSM) .....................................................................................90
6.9 Single Action Submodule (SASM) .............................................................................................93
6.10 Double-Action Submodule (DASM) ...........................................................................................97
6.11 Real-Time Clock Submodule (RTCSM) with Low-Power Oscillator ........................................104
6.12 Parallel Port I/O Submodule (PIOSM) .....................................................................................107
6.13 Static RAM Submodule (RAMSM) ..........................................................................................108
6.14 RTCSM and RAMSM Standby Operation ...............................................................................108
6.15 CTM6 Interrupts ......................................................................................................................109
7 Electrical Characteristics
111
TABLE OF CONTENTS
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cale Semiconductor,
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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