II
Chip Inductor
貼片電感
Contents / 目錄
Page
SCFL Series 26
SCML Series 30
SCWL201610 Series 32
SCWL252010 Series 34
SCWL252012 Series 36
SCWL252010XXXXQ Series
38
SCWL252012XXXXQ Series
41
Chip Bead
貼片磁珠
SCGB-S Series 45
SCGB-H Series 48
SCGB1005-B Series 50
SCPB-S Series 52
SCHB1005G Series 55
SCGB-W & SCPB-W & SCPB-W Series 57
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25
Chip Inductor
貼片電感
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26
Chip Ferrite Inductor SCFL Series
u The monolithic construction performs high reliability and
ensures a closed magnetic flux in a component avoids
magnetic and interference
u All for higher mounting density
u RF and wireless communication
u Information technology equipment which includes computer
u Telecommunications
u Radar detectors
u Automotive etc.
Unit: mm
Dimension
1608
(EIA 0603)
201209
(EIA 0805)
201212
(EIA 0805)
3216
(EIA 1206)
L 1.60±0.15 2.00±0.20 2.00±0.20 3.20±0.20
W 0.80±0.15 1.25±0.20 1.25±0.20 1.60±0.20
T 0.80±0.15 0.90±0.20 1.25±0.20 1.10±0.20
E 0.30±0.20 0.50±0.20 0.50±0.20 0.50±0.20
The thickness of 2012 specification under 4.7µH is 0.90mm±0.20mm
Unit: mm
Size A B C
1608 0.5~0.7 2.1~3.1 0.65~0.95
2012 1.0~1.2 3.0~4.0 0.8~1.1
3216 2.0~2.4 4.2~5.2 1.0~1.4
Construction & Dimensions
Features
Recommended Pad Layout
L
T
E
E
W