Page 1 of 4
Advanced Connectivity Solutions
100 S. Roosevelt Avenue, Chandler, AZ 85226
Tel: 480-961-1382 Fax: 480-961-4533 www.rogerscorp.com
DRILLING CONDITIONS:
Surface speeds greater than 500 SFM and chip loads less than 0.002” (0.05mm) should be avoided whenever
possible. When using small diameter drills (<0.0135”) use below a 0.002” chip load to avoid random breakage of
drill bits.
Recommended Ranges:
Surface Speed: 300-500 SFM (90 to 150m/min)
Chip Load: 0.002”-0.004”/rev. (0.05-0.10 mm)
Retract Rate: 500-1000 IPM 500 IPM (12.7 m/min) for tools less than
0.0135” (0.343mm), 1000 IPM (25.4 m/min) for all others.
Tool Type: Standard carbide
Tool Life: 2000-3000 hits
Hole quality should be used to determine the effective tool life rather than tool wear. These materials will yield
good hole quality when drilled with bits which are considered worn by epoxy/glass standards. Unlike epoxy/glass,
RO4700™ material hole roughness does not increase signifi cantly with tool wear. Typical values range from
8-25mm regardless of hit count (evaluated up to 8000 hits). The roughness is directly related to the ceramic
fi ller size and provides topography that is benefi cial for hole-wall adhesion. Drilling conditions used for epoxy/
glass boards have been found to yield good hole quality with hit counts in excess of 2000.
A minimum PTH spacing of 12 mil wall to wall for electrically isolated vias and 6-8 mils for thermal and shielding
vias that redundantly connect copper layers (to prevent sphere edge to edge drilling and chemical ingress) and a
hole wall roughness min spec of 2 mils.
CALCULATING SPINDLE SPEED AND INFEED:
12 x [Surface Speed (SFM)]
Spindle Speed (RPM) =
p x [Tool Diam. (in.)]
Feed Rate (IPM) = [Spindle Speed (RPM)] x [Chip Load (in/rev.)]
Example:
Desired Surface Speed: 400 SFM
Desired Chip Load: 0.003”(0.08 mm)/rev.
Tool Diameter: 0.0295”(0.75 mm)
12 x [400]
Spindle Speed = = 51,800 RPM
3.14 x [0.0295]
Infeed Rate = [ 51,800] x [0.003] = 155 IPM
RO4700
™
(RO4725JXR
™
, RO4730JXR
™
&
RO4730G3
™
)
Antenna Grade Laminates
Fabrication Guidelines
Technical ArticlesFabrication Notes
Page 2 of 4
Advanced Connectivity Solutions
100 S. Roosevelt Avenue, Chandler, AZ 85226
Tel: 480-961-1382 Fax: 480-961-4533 www.rogerscorp.com
QUICK REFERENCE TABLE:
Tool Diameter Spindle Speed (kRPM) Infeed Rate (IPM)
0.0100” (0.254mm) 95.5 190
0.0135” (0.343mm) 70.7 141
0.0160” (0.406mm) 95.5 190
0.0197” (0.500mm) 77.6 190
0.0256” (0.650mm) 60.0 180
0.0258” (0.655mm) 60.0 180
0.0295” (0.749mm) 51.8 155
0.0354” (0.899mm) 43.2 130
0.0394” (1.001mm) 38.8 116
0.0453” (1.151mm) 33.7 101
0.0492���(1.257mm) 31.1 93
0.0531” (1.349mm) 28.8 86
0.0625” (1.588mm) 24.5 74
0.0925” (2.350mm)` 16.5 50
0.1250” (3.175mm) 15.0 45
* Conditions stated are tapered from 200SFM and 0.002” chip load up to 400 SFM and 0.003”chip load.
DEBURRING:
RO4700 materials can be deburred using conventional nylon brush scrubbers.
DESMEAR:
RO4700 materials may be desmeared using traditional chemical or plasma processes. Recommended plasma
conditions are provided below:
Plasma Desmear Cycle:
Frequency:
40 KHz
Voltage:
500-600V
Power:
4000-5000 Watts
Pre-Heat to 60°C using:
Gases:
90% O2, 10% N2
Pressure:
250 mTORR
Desmear using:
Gases:
75% O2, 15% CF4, 10% N2
Pressure:
250 mTORR
Time:
10-30 minutes
COPPER PLATING:
No special treatments are required prior to electroless copper plating. Board should be processed using
conventional epoxy/glass procedures. Desmear of drilled holes is not typically required, as the high Tg (280°C
[536°F]) resin system is not prone to smearing during drill. Resin can be removed using a standard CF4/O2
plasma cycle or a double pass through an alkaline permanganate process should smear results from aggressive
drilling practices.