MPPC (Multi-Pixel Photon Counter)
S13362 series
Significantly reduced crosstalk, low afterpulses
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S13362-3050DG
1
The S13362 series can reduce dark count by cooling in addition to low afterpulses and low crosstalk of the S13360 series. The
S13362 series integrates the S13360 series with thermoelectric cooler. The photosensitive area is available in two sizes of 1.3 × 1.3
mm and 3.0 × 3.0 mm.
Significantly reduced crosstalk
High gain: 10
5
to 10
6
Superior photon counting capability
Operates with simple readout circuit
Low afterpulses
Low dark count (no more than 1/20 the count at room
temperature by cooling)
Low voltage (VBR=51.1 V typ.) operation
Features
Low light level detection
Flow cytometry
Fluorescence measurement
Environmental analysis
Various academic research
Scattered light measurement
DNA sequencers
Laser microscopes
Applications
Pulse waveform comparison (typical example)
Lower noise
When an MPPC detects photons, the output may contain spurious pulses, namely afterpulse and crosstalk, that are separate from the out-
put pulses of the incident photons. Afterpulses are output later than the timing at which the incident light is received. Crosstalk is output
from other pixels at the same time as the detection of light.
Previous products achieved lower afterpulse through the improvement of material and wafer process technology, but with the S13362 se-
ries, low crosstalk has been achieved in addition to low afterpulse.
(M=1.25 × 10
6
)
10 ns
50 mV
Previous product
Improved product (reference data: S13362-3050DG)
(M=1.25 × 10
6
)
10 ns
50 mV
MPPC (Multi-Pixel Photon Counter) S13362 series
2
Structure
Parameter
S13362
Unit
-1350DG -3050DG
Effective photosensitive area 1.3 × 1.3 3.0 × 3.0 mm
Pixel pitch 50 m
Number of pixels/ch 667 3600 -
Fill factor 74 %
Package Metal (TO-8) -
Window Borosilicate glass -
Refractive index of window material 1.52 -
Cooling Two-stage TE-cooling -
Absolute maximum ratings
Parameter Symbol Value Unit
Operating temperature*
1
Topr -20 to +60 °C
Storage temperature*
1
Tstg
-20 to +85
°C
Chip temperature Tchip -25 to ambient temperature °C
Thermistor power dissipation Pd_th 0.2 mW
TE-cooler allowable current I
TE max 1 A
TE-cooler allowable voltage V
TE max 0.9 V
Soldering conditions*
2
- 350 °C max.*
3
, once, 3 s max. -
*1: No dew condensation
When there is a temperature difference between a product and the surrounding area in high humidity environment, dew condensation
may occur on the product surface. Dew condensation on the product may cause deterioration in characteristics and reliability.
*2: At least 1 mm away from lead root
*3: Soldering iron tip
Note: Exceeding the absolute maximum ratings even momentarily may cause a drop in product quality. Always be sure to use the product
within the absolute maximum ratings.
Electrical and optical characteristics (Typ. Ta=25 °C, Tchip=-10 °C, unless otherwise noted)
Parameter Symbol
S13362
Unit
-1350DG -3050DG
Spectral response range 320 to 900 nm
Peak sensitivity wavelength p 450 nm
Breakdown voltage V
BR 51.1 ± 5 V
Photon detection effi ciency at p*
4
PDE 40
%
Recommended operating voltage Vop V
BR + 3 V
Dark count
Typ.
-
525
kcps
Max. 13 72
Crosstalk probability - 3 %
Terminal capacitance Ct 60 320 pF
Gain M 1.7 × 10
6
-
Temperature coefficient of
recommended reverse voltage
TVop 54 mV/°C
Recommended temperature of TE-cooler
TTE_recom
-10 °C
Thermistor resistance*
5
Rth 9 k
Thermistor B constant*
6
B 3410 K
*4: Photon detection ef��� ciency does not include crosstalk and afterpulses.
*5: Thermistor temperature=25 °C
*6: T1=25 °C, T2=50 °C
Note: The above characteristics were measured at the operating voltage that yields the listed gain. (See the data attached to each product.)