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Revision: 13-Mar-17
1
Document Number: 61050
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High Frequency RF Spiral Inductor for Wire Bonded Assemblies
PSC series RF spiral inductors are designed for RF circuits
that require wire bondable components. High precision
equivalent circuit modeling enables accurate computer
simulation of component performance. Additional values
and form factors available upon request.
FEATURES
• Wire bond assembly
• Small size: 45 mils x 45 mils x 10 mils
• Low DCR, high Q
• Low parasitic capacitance, high SRF
APPLICATIONS
• RF choking for DC biasing
• RF tuning circuits
• Lumped element filters
Note
(1)
Main source of value tolerance is due to variation in wire bonds. See “text fixture” section below
Note
(1)
Including the added inductance and resistance of typical bond wires. See equivalent circuit section
STANDARD ELECTRICAL SPECIFIACTIONS
PARAMETER VALUE UNIT
Inductance Range 0.001 to 0.1 μH
Tolerance
(1)
± 20 %
Max. Power Handling 250 mW
Operating Temperature -55 to +125 °C
Storage Temperature -55 to +125 °C
RF CHARACTERISTICS - TYPICAL VALUES
PART NUMBER
INDUCTANCE
(nH)
DCR
()
IN-CIRCUIT
INDUCTANCE
(1)
(nH)
IN-CIRCUIT
DCR
(1)
()
Q
(UNITLESS)
SRF
(GHz)
250 MHz 1000 MHz 250 MHz 1000 MHz
PSC3400C 3.4 3.4 0.26 6 0.36 8 14 10.2
PSC1050B 10.5 10.5 0.9 12 1 10 16 5.5
PSC1250B 12.5 12.5 0.9 15 1 12 18 5.0
PSC1800B 18 18 1.25 20.5 1.35 13 15 4.2
PSC4500B 45 50 3.4 47.5 3.5 13 8 2.4
DIMENSIONS in inches (millimeters)
LENGTH WIDTH THICKNESS BOND PAD DIAMETER
0.045 ± 0.002 (1.143 ± 0.051) 0.045 ± 0.002 (1.143 ± 0.051) 0.010 ± 0.001 (0.254 ± 0.0254) 0.006 (0.152)
0.045
0.006