2U AMD G34 platform for General
applications
TA70-B8237
Specifications are subject to change without notice. Items pictured may only be representative.
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DUAL-SOCKET
AMD G34
PLATFORM
B8237T70V24HR
Dual G34 socket supports (2) AMD 32nm 8-Core/12-Core/16-Core
Opteron 6300 Series Processors (Abu Dhabi)
AMD® SR5670 + SP5100
(12+12) 240-pin DDR3 DIMM slots
Supporting up to 768GB R-DDR3 1866/1600/1333/1066/800 memory
(2) PCI-E Gen.2 x16 slots (w/ x8 link)
(1) Mezzanine slot (w/ x8 link) for selective network I/O adapters
(24+2) 2.5” SAS/SATA HDD Bays
*(24) drives need a discrete HBA/RAID adapter to enable
(1) GbE (via Broadcom BCM5725)
Onboard Broadcom BCM5725 w/ IPMI
(1+1) Redundant, ERP1U high-efficiency 750W, 80 Plus Gold
Certified
TYAN Business Unit
MITAC INTERNATIONAL CORP.
Specifications
USA
Tel: +1-510-651-8868
Fax: +1-510-651-7688
Taiwan
Tel: +886-2-2652-5888
Fax: +886-2-2652-5805
China
Shanghai Tel: +86-21-61431188 Ext 1366
China Tel:-86-010-62555015 Ext 8302
Japan
Tel: +81-3-3769-8311
Fax: +81-3-3769-8328
Europe
Sales: +32 2456 1721
Technical Support: +32 2456 1722
TA70-B8237
B8237T70V24HR
(Specifications are subject to change without notice. Items pictured may only be representative.)
(24)Hot-swap 2.5”HDDs
(3) 6056 fans + (2) 6038 fans
S8237PN
(2) G34 sockets
(12+12) R-DDR3
1866/1600/1333/1066
MHz Max. 768GB
(1) GbE ports
(2) internal 2.5” HDDs Bay
ICM Card
PWR / ID / Reset Button PWR
/ IPMI / ID LED
(2) Front USB 2.0 Ports
GOLD
2U Rackmount
TA70
27.56" x 17.17" x 3.43" (700 x 436 x 87mm)
S8237PN
31KG
(1) PWR / (1) RST / (1) ID
(1) PWR / (1) ID / (1) Warning
(2) USB ports
2.5" Hot-Swap / (24) *Need a discrete
HBA/RAID adapter to enable
SAS / SATA 6.0Gb/s
2.5" f ixed / (2)
SATA-II 3.0Gb/s
System
Cooling
Configuration
(3) 6056 fans + (2) 6038 fans
ERP1U
1+1
AC100V ~ AC240V/ 9.5A~5A
750 Watts
80-plus gold
AMD 45nm 8-Core/12-Core Opteron 6100
Series Processors (Magny -Cours) / AMD 32nm
8-Core/12-Core/16-Core Opteron 6200 Series
Processors (Interlagos) / AMD 32nm 8-
Core/12-Core/16-Core Opteron 6300 Series
Processors (Abu Dhabi)
G34 / (2)
UP to 140W
*No fan redundancy when 140W CPUs are deployed
Up to 6.4 GT/s Hy per-Transport link support
AMD SR5670 + SP5100
NCT6681D
(12)+(12) DIMM slots
RDDR3 800/1066/1333/1600 MHz
Up to 768GB RDIMMs
4 Channels per CPU
Memory
Suppor
ted DIMM Qty
DIMM Type / Speed
Capacity
Memory channel
Redundancy
Output Watts
Gross Weight
System
(Recommend
Chassis)
Buttons
FAN
Power Supply
Type
Internal Drive
Bay
Type / Q'ty
Supported HDD
Interface
Input Range
Efficiency
LEDs
I/O Ports
Front Panel
Supported HDD
Interface
Type / Q'ty
Motherboard
External Drive
Bay
Form Factor
Chassis Name
Dimension (H x W x D)
Average CPU Power
(ACP) wattage
System Bus
Chipset
Super I/O
Processor
Supported CPU
Series
Socket Type / Q'ty
Chipset
(2) PCI-E Gen.2 x16 slots (w/ x8 link)
M2212-R16-2F/ (2)
(1) Mezzanine slot (w/ x8 link) f or selectiv e
network I/O adapters
(1) GbE
Broadcom BCM5725
Connector (24) SAS
Speed
6.0 Gb/s
RAID
From discrete HBA/RAID adatper
Connector
(2) SATA
Controller
AMD SP5100
Speed
3.0 Gb/s
RAID
RAID 0/1/10
(4) ports (2 at f ront, 2 at rear)
(1) ports
NCT6681D
Monitors temperature f or CPU
Ov er temperature warning indicator / Fan &
PSU f ai
l LED indicator
Watchdog timer support
System
Management
Onboard Broadcom BCM 5725
4MB
User-conf igurable H/W monitoring / ACPI
3.0/ACPI sleeping states S1,S4,S5 / PXE
boot support / SMBIOS 2.5/PnP/Wake on LAN
Class A
Yes
10° C ~ 35° C (50° F~ 95° F)
- 40° C ~ 70° C (-40° F ~ 158° F)
90%, non-condensing at 35° C
RoHS
Yes
I/O Ports
USB
RJ-45
SAS
Pre-install TYAN
Riser Card
PCI-E
Expansion
Slots
BIOS
Feature
LED
Chipset
Regulation
FCC (DoC)
CE (DoC)
Onboard Chipset
Temperature
Brand / ROM size
Operating
Environment
Operating Temp.
Non-operating Temp.
In/Non-operating
Humidity
RoHS 6/6 Complaint
Notice
SATA
System
Monitoring
Others
LAN
Port Q'ty
Controller
Storage
(1+1) 750W hot-swap ERP1U,
80+ Gold
(1) PCI-E G2 x8 Mezzanine Card
(1) FH PCI-E G2 x16 slot(w/ x8 link)
(1) FH PCI-E G2 x16 slot(w/ x8 link)