Anti-whisker formation of leadfree plating
1. The Applicable Product
BA12003BF-E2
2. Evaluation Package
No Item Information
1 Subject LSI product of Leadfree plating
2 Type of Terminal Plating Sn
3 Plating Grain Size 2µm to 10µm
4 Bath type Alkyl sulfonic acid, Electro plating
5 Matt or Bright Matt
6 Under Plating None
7 Type of Frame FeNi frame
3. Compliance standerds
Tin Whisker Acceptance Test Requirements (NEMI Tin Whisker Users Group, July 28, 2004)
4. Test Flow
No Test Flow Test Condition
1 Preparation M.P. condition
2 Pre Inspection SEM x 250, Top/Side/Forming Section
3 Preconditioning-1 Storage at ambient temp. for 4 weeks
4 Preconditioning-2 215°C Reflow, 255°C Reflow
5 Applying Stress
1. 30°C, 70% RH, 4,000ｈr
2. 60°C, 87% RH, 4,000ｈr
3. -55/+85°C, 2,000cyc
4. 30°C, 70%, Bias, 4,000ｈr
6 Screening Inspection x 50, Top/Side/Forming Section
7 Detailed Inspection SEM x 250, Top/Side/Forming Section
5. Test Result
Criteria : Not allow, the whisker is larger than 40µm between lead to lead.
No Preconditioning-1 Preconditioning-2 Stress Condition
Result:Pn/n
(pcs)
1
Storage at ambient
temprature.
4 weeks
None
30°C, 70% RH 4,000hr 0 / 96
2 60°C, 87% RH 4,000hr 0 / 96
3
215°C Reflow Simulation
30°C, 70% RH 4,000hr 0 / 96
4 60°C, 87% RH 4,000hr 0 / 96
5
255°C Reflow Simulation
30°C, 70% RH 4,000hr 0 / 96
6 60°C, 87% RH 4,000hr 0 / 96
7 215°C Reflow Simulation –55/+85°C 2,000cyc 0 / 96
8 255°C Reflow Simulation –55/+85°C 2,000cyc 0 / 96
9 215°C Reflow Assembly 30°C, 70%, Bias 4,000hr 0 / 96
Therefore, wisker is no problem.
02.Nov.2015
Yoshitaka Ichise
General Manager Quality Control Division
LSI Production Headquarters ROHM Co., Ltd.
www.rohm.com
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